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  6. Comparison of cross-sectional observation images

Comparison of cross-sectional observation images

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last updated:Jul 27, 2026

アイテス
アイテス
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We will introduce suitable observation methods for cross-sectional observation of chip resistors and copper wiring sections!

To assist you in selecting an observation device, we will introduce the differences in visibility between metal microscopes, W-SEM, and FE-SEM. When observing the cross-section of chip resistors, there are areas that are difficult to observe at low magnification with a metal microscope, but with SEM observation, the depth of focus is greater, allowing for high-flatness images even at low magnification. When observing the cross-section of copper wiring, the copper-resin interface and the condition inside cracks can be observed with W-SEM, but with FE-SEM, it is possible to clearly observe even the crystal grains and tiny voids at the connection interface. [Comparison] ■ Cross-section observation of chip resistors: Comparison of images between metal microscope and W-SEM ■ Cross-section observation of copper wiring: Comparison of images between W-SEM and FE-SEM *For more details, please download the PDF or feel free to contact us.

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Comparison of cross-sectional observation images

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  • Related Link - https://www.ites.co.jp/

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Comparison of cross-sectional observation images

Comparison of cross-sectional observation images

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Analysis of the assembly joint of the implementation components

Analysis of the assembly joint of the implementation components

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Cross-section polishing service for implementation parts and electronic components.

Cross-section polishing service for implementation parts and electronic components.

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Surface mount electronic component cross-sectional observation service

Surface mount electronic component cross-sectional observation service

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Cross-sectional observation of substrate-mounted components.

Cross-sectional observation of substrate-mounted components.

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Cross-sectional observation of substrate-mounted components (1) to (6)

Cross-sectional observation of substrate-mounted components (1) to (6)

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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