Heat distortion can be predicted. Design issues can be prevented through simulation.
★★Shirutoku Report: Useful Information You Should Know★★ One of the challenges that cannot be overlooked in electronic components and circuit board design is deformation caused by heat. This time, we will discuss thermal warping that occurs due to temperature changes in multilayer structures with different materials in each layer.
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As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.
