[Book] Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management (No. 2260)
~ Substrate, Joining, Sealing, Cooling Technologies ~
◎ A thorough explanation of Si, SiC, GaN, gallium oxide, the required characteristics in automotive environments, and implementation examples!
◎ Detailed guidelines for designing TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"!
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■ Table of Contents
Chapter 1: Trends in the Development and Device Applications of Power Semiconductors
Chapter 2: Design of Heat-Resistant and Heat-Dissipating Substrate Materials and Improvement of Reliability
Chapter 3: Design of Joining Materials and Technologies and High-Temperature Connection Reliability
Chapter 4: Design of Sealing Materials and Response to High-Temperature Operation
Chapter 5: Design of Heat-Resistant and Heat-Dissipating Resins and Expansion Relief Materials
Chapter 6: Design of Cooling Components, Development of Cooling Technologies, and Implementation Techniques
Chapter 7: Thermal Design of Power Devices and High-Heat-Resistant, High-Heat-Dissipating Packaging Technologies
Chapter 8: Reliability and Thermal Characteristics Evaluation of Power Devices
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● Publication Date: August 30, 2024 ● Format: A4, 569 pages
● Authors: 60 contributors ● ISBN: 978-4-86798-030-9
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