Top-class heat resistance with resin film. Achieves the same dimensional stability as glass and ceramics! Suitable for applications such as substrates for semiconductors and sensors, as well as release films.
ZeniMax Japan's high heat-resistant polyimide film has the highest level of dimensional stability and high heat resistance among polymer films, making it suitable for applications such as alternatives to glass, silicon wafers, ceramics, and metals, as well as for composites. Leveraging features such as "thin, flexible, lightweight, unbreakable, and easy to process," it can be applied to thin film transistor substrates that are becoming lighter, thinner, and larger, as well as to semiconductor package substrates that are becoming more densely packed. 【Features】 ■ Excellent dimensional stability: Comparable to glass and silicon wafers, with a linear expansion coefficient of 0-3 ppm/K ■ High heat resistance: Maintains flatness at 450°C (no warping or deformation) ■ Excellent surface smoothness: Comparable to display glass substrates, with a surface roughness of Ra ≈ 0.5 nm *For detailed specifications, please download the PDF. Feel free to contact us for more information.
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Zenomax Japan Co., Ltd. was established in April 2018 as a joint venture between Toyobo Co., Ltd. and Nagase & Co., Ltd. It manufactures and sells the high heat-resistant polyimide film "Zenomax®," developed by Toyobo. The high heat-resistant polyimide film "Zenomax®" leverages its unique high performance, which combines the advantages of polymer films such as being "thin," "light," "unbreakable," and "flexible," with high heat resistance and low CTE comparable to inorganic materials. It is applied in various fields, responding to a wide range of customer needs, including displays, circuit boards, sensors, thermomodules, and heaters.
