Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car flows. Compared to conventional methods, it has a smaller footprint.
Samsung Diamond Industry utilizes its unique technology, the SnB "Scribe & Break" method, to precisely cut and process device substrates with metal films or silicone resins laminated on materials such as silicon carbide (SiC), gallium nitride (GaN), alumina (Al2O3), sapphire, silicon nitride (Si3N4), and silicon (Si) since its establishment. With MDI's proprietary SnB "Scribe & Break" technology, we achieve zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while being environmentally friendly due to the absence of water use, allowing for a reduction in production costs. **Features of MDI's proprietary SnB (Scribe & Break) technology:** - Stable high-speed cutting is possible for high-frequency devices and power devices! - High-precision and high-quality cutting allows for reduced street width and accommodates small sizes! - Compatible with various semiconductor/electronic component processing! - Also supports multilayer composite materials! We propose optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.*
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basic information
■Precision Cutting Equipment for Semiconductor Devices 【Product Features】 DS Series (Scriber) Substrate Thickness: 100um-350um Ring Size: 8-12 inch DB Series (Breaker) Substrate Thickness: 100um-350um Ring Size: 8-12 inch DL Series (Scribe & Break Inline Machine) Substrate Thickness: 100um-350um Ring Size: 8-12 inch DR Series (Remounter Machine & Film Replacement Machine) Substrate Thickness: 100um-350um Ring Size: 8-12 inch ■MDI's Original Tools Achieving Long Lifespan. Tools developed with proprietary technology for semiconductor devices ensure long lifespan for scribing distances on SiC (hard-to-cut materials). *For more details, please download the catalog or contact us directly. Additionally, we have numerous achievements in dividing various devices (materials) such as Glass, SiC, LCD, Al2O3, Si, Sapphire, Glass+Si, GaAs, LTCC, InP, etc.
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We support cutting and processing of various semiconductors/electronic components. *For more details, please refer to the catalog.
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Company information
Samusung Diamond Industry is a manufacturer of processing equipment that provides optimal process conditions using original cutting edges and laser oscillators for processing methods such as scribing, breaking, drilling, and patterning, along with automated devices that achieve high productivity. Since its founding in 1935, the company has utilized its "high-quality cutting technology for various types of glass" to offer processing processes, equipment, and tools that can handle "all kinds of brittle materials, as well as multilayer structures including metals and organic materials." With solutions backed by theory and proven results, we aim to be a reliable "one-and-only partner" for our customers. Please feel free to contact us.
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