三星ダイヤモンド工業 List of Products and Services

Samsung Diamond Industry utilizes its unique technology, the SnB "Scribe & Break" method, to precisely cut and process device substrates with metal films or silicone resins laminated on materials such as silicon carbide (SiC), gallium nitride (GaN), alumina (Al2O3), sapphire, silicon nitride (Si3N4), and silicon (Si) since its establishment. With MDI's proprietary SnB "Scribe & Break" technology, we achieve zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while being environmentally friendly due to the absence of water use, allowing for a reduction in production costs. **Features of MDI's proprietary SnB (Scribe & Break) technology:** - Stable high-speed cutting is possible for high-frequency devices and power devices! - High-precision and high-quality cutting allows for reduced street width and accommodates small sizes! - Compatible with various semiconductor/electronic component processing! - Also supports multilayer composite materials! We propose optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.*

• others

The PCD materials we use are developed in collaboration with major material manufacturers. The bonding between particles has also been strengthened, making it superior in wear resistance and durability compared to products from other companies. We have achieved maintenance-free operation due to extended lifespan (10 to 100 times compared to other metal parts)! We assist in reducing waste loss, contributing to "manufacturing that protects the global environment through our customers." 【Other compatible materials】 We also handle high-precision machining of various materials such as carbide, SUS, and steel. 【Main equipment and technology】 ■ Surface grinding machine: perpendicular, parallel, flatness below 2μm ■ Wire electrical discharge machine: more than 20 underwater wire machines and 3 oil wire machines. Achieved hole machining with a diameter of 70μm ■ Mirror finishing: sintered diamond surface roughness below 0.01μm ■ Brazing machine: capable of handling various sizes and shapes ■ Equipped with PG (profile grinder) and cylindrical grinding machines *We are accumulating technology, building relationships, and advancing product development while addressing our customers' challenges. Please feel free to contact us first.

• Processing Technology
• Work tools

This is the mechanism of scribing illustrated with glass cutting as an example. Scribing is a cutting method that utilizes the properties of hard and brittle materials. By accurately controlling the generation and propagation of fine cracks, high-precision cutting can be achieved with high quality. 【Cracks during scribing occur in two stages】 First stage: Cracks propagate when the scribing wheel is under load. Second stage: After the wheel passes, cracks propagate again due to residual stress. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Technology

We develop and produce tools for mechanical scribing in-house. We are exploring tool materials based on diamond, developing shapes suitable for the materials, and have established processing techniques for difficult-to-cut tool materials. <Material Exploration> ■ To extend the tool's lifespan, we are developing tools based on PCD (polycrystalline diamond). <Shape Development> ■ A glass cutter designed with a chip in a wheel shape for easy cutting processing. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Technology

"Scribe & Break processing" is a cutting method that utilizes the physical properties of the processed material. It is a dry processing method that does not use water, and it allows for high-speed processing. On the other hand, it is greatly influenced by the material's physical properties (especially crystal orientation), making it challenging to determine the processing conditions. Additionally, the scribe & break technique has been used for a long time as a method for cutting hard and brittle materials like glass. 【Features】 ■ Support for fine processing - Suitable for cutting small chips from thin substrates - Minimal vibration during processing, with little risk of chips flying off ■ Support for curved processing - Capable of processing curves (3D processing) in applications - Laser scribing allows for cutting with even smaller radii *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Technology

Samsung Diamond Industry utilizes its unique technology, the SnB "Scribe & Break" method, to precisely cut and process device substrates with metal films or silicone resins layered on materials such as silicon carbide (SiC), gallium nitride (GaN), alumina (Al2O3), sapphire, silicon nitride (Si3N4), and silicon (Si) since its establishment. With MDI's proprietary SnB "Scribe & Break" technology, we achieve zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while being environmentally friendly due to the absence of water use, allowing for a reduction in production costs. **Features of MDI's proprietary SnB (Scribe & Break) technology:** - Stable and high-speed cutting processing for high-frequency and power devices! - High-precision and high-quality cutting processing enables reduction of street width and accommodates small sizes! - Compatible with various semiconductor/electronic component processing! - Supports multilayer composite materials! We propose optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.*

• others

Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates, which are layered with metal films or silicone resins on materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With its unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for a reduction in production costs due to the absence of water usage. 【Features】 ■ Stable and high-speed cutting processing is possible for many materials! ■ High-precision and high-quality cutting processing enables reduced street width and small size compatibility! ■ Compatible with various semiconductor/electronic component processing! ■ Also supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.

• Waterproofing work