What is the 3D CAD required for semiconductor manufacturing equipment design?
3D CAD that achieves a reduction in lead time for semiconductor equipment development! Realizing ultra-fast response capable of handling 3 million parts in 0.2 seconds.
In recent years, the development of semiconductor manufacturing equipment has seen a significant increase in the complexity of required functions, resulting in a vast number of components being handled. Consequently, the biggest challenge has become how to efficiently arrange various mechanical devices within a limited space. 'iCAD SX V8' is a domestically developed 3D CAD specialized for mechanical design, created to support Japanese manufacturing. iCAD achieves high-speed response, capable of handling 3 million components in 0.2 seconds, allowing for stress-free design consideration and verification of the entire semiconductor manufacturing equipment, which can involve tens of thousands of parts. Leveraging its ability to manage vast amounts of information, it is possible to accumulate and utilize all necessary design information for equipment development, including piping, wiring, and control (movement), into a single CAD data set. This single data set can be used across various scenarios and departments, from design to manufacturing, assembly, and maintenance. *Case studies from semiconductor manufacturing equipment manufacturers are available for limited viewing on a special website. Please click the link below to download.
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【Features】 ■ Adopted by many leading manufacturers of semiconductor manufacturing equipment ■ Significantly reduces lead time for the entire equipment development, not just design ■ Proven track record of zero interference and substantial reduction in rework (Examples include a 25% reduction in design time and a 20% reduction in man-hours until drawings are completed) ■ Design for mechanics, piping, wiring, and control (motion) is achieved with a single tool (iCAD only) 【Challenges When Attempting to Design with 3D CAD】 ■ Handling a vast number of parts leads to poor response, making it difficult to consider and verify the entire equipment ■ In the stage where the layout is not yet determined (design changes occur frequently), conditions are not fixed, making it impossible to conduct conceptual discussions in history-based 3D CAD, which requires prior determination of part composition (constraints and history are bottlenecks) ■ Mechanics and piping can only be considered with separate tools, preventing the ability to check interactions between them during the design process *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ Design of semiconductor manufacturing equipment ■ Various design verifications (interference, operation) ■ Automation of various ancillary tasks (automatic output of reports and parts lists, error checking) ■ Visualization of assembly procedures and accumulation of know-how *For more details, please refer to the PDF materials or feel free to contact us.
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To support Japan's manufacturing, iCAD Corporation is developing the specialized 3D CAD 'iCAD SX V8' focused on mechanical design. iCAD achieves high-speed response, handling 3 million parts in 0.2 seconds, allowing for stress-free design consideration and verification of large-scale equipment and entire production lines consisting of tens of thousands of components. Leveraging its capability to handle vast amounts of information, it is possible to accumulate and utilize the design information necessary for equipment development, including piping, wiring, and control (motion), into a single CAD data set. This single data set can be utilized across various scenarios and departments, from design to manufacturing, assembly, and maintenance. This results in reduced development lead times and improved design quality.
