Introducing the advantages and disadvantages of 3D construction using X-ray CT and FIB slice cross-sections, as well as 3D construction methods using mechanical polishing!
We will introduce a 3D construction method using mechanical polishing as a case study. Ceramic capacitors have a structure where thin film electrodes are stacked internally, and the internal electrodes cannot be confirmed using X-ray CT as they appear transparent. Additionally, 3D construction using FIB slice cross-sections is limited to localized confirmation due to the sample being a few millimeters in size. The 3D construction method using mechanical polishing can sometimes enable 3D construction to compensate for the areas where X-ray CT and FIB slice cross-sections are not effective. [Case Study of 3D Construction of Ceramic Capacitors Using Mechanical Polishing] ■ X-ray CT image: Internal electrodes cannot be confirmed ■ 3D construction using FIB slice cross-sections: Limited to localized confirmation ■ 3D construction using mechanical polishing: Internal electrodes can be confirmed, allowing for extensive 3D observation *For more details, please refer to the PDF document or feel free to contact us.
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**Advantages and Disadvantages of 3D Construction Using X-ray CT and FIB Slice Cross-Sections (Excerpt)** ■ X-ray CT - Method: Rotating the sample to obtain continuous 360-degree images and construct a 3D image - Advantages: Enables non-destructive 3D imaging - Disadvantages: Not suitable for heavy metals or thick samples as X-rays cannot penetrate them ■ FIB Slice 3D - Method: Creating multiple cross-sections through FIB slicing and capturing images each time - Advantages: Provides images magnified up to tens of thousands of times, allowing for sub-micron order 3D imaging - Disadvantages: Not non-destructive due to the FIB processing *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.