Streamlining the application of sealing tape for MEMS sensors (Case Study Release)
In the manufacturing/assembly process of MEMS, film lamination is also necessary... It can be used for the automation and labor-saving of sealing tape with few adhesion points (at the edges)!
Even though it's called MEMS, it is widely active in the world. This time, what our company is focusing on is the automation and labor-saving of sealing tape to protect MEMS microphones and other devices from contamination by fine particles and splashes of soldering liquid. You may want to apply sealing tape, but the cost doesn't add up for manual application... You want to automate it, but you don't know how to peel it off... There are various barriers to automation and labor-saving. The Film Feeder we provide can transport fine tapes of 1×1mm and tapes that are difficult to peel due to lack of stiffness. If you are considering automating and labor-saving for applications like attaching waterproof breathable films, please check our materials. *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Peeling work size: Work transfer and adhesion at any position 1×1mm to 25×30mm ■A system has been established for test work production and adhesion experiment verification. 【Seal and Tape Usage Examples】 ■Attachment of reinforcement plates ■Attachment of PI (polyimide) ■Lamination processing (adhesion) ■Noise countermeasures / attachment of shielding materials ■Attachment of cover layers ■Assembly of flexible antenna reflective materials ■Multi-layer assembly of FPC ■Attachment of waterproof vent films to MEMS microphones and sensors ■Attachment of cushioning materials to housings and contact areas ■Attachment of mechanical parts / waterproof seals ■Assembly of optical units (light guides, diffusion films, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Peeling of fine work mounted on PET film *For more details, please refer to the PDF document or feel free to contact us.
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Our company leverages two strengths: "measurement and control technology" and "design and assembly technology for precision components," focusing on creating new value in manufacturing. As a pioneering company, we have long accumulated technology in the field of non-destructive inspection equipment for fruits and vegetables. We have expanded our focus from traditional measurements centered on the sugar content of fruits to inspecting for rot, cavities, and browning inside vegetables. By developing machines that can accurately inspect produce with variations in shape and quality even under harsh operating conditions, we significantly contribute to quality assurance of the internal quality of fruits and vegetables in Japanese agriculture. In the field of electronic component mounting, we have been engaged in OEM and ODM production of tape feeders and surface mount technology for over 30 years, featuring production facilities that can flexibly accommodate everything from small quantities of diverse products to mass production. Recently, leveraging our years of technology and experience, we developed an original splicing jig that realizes labor-saving in board mounting. This has already attracted inquiries from many companies and received high praise from the market.