Measuring the area ratio of internal voids in solder! By combining mechanical polishing, a comprehensive evaluation is possible.
In the evaluation of BGA and CSP solder, the area ratio of voids within the solder can be measured from transmitted X-ray image data. Furthermore, by combining mechanical polishing, a comprehensive evaluation is possible. Please feel free to consult us when needed. 【Features】 ■ Non-destructive evaluation of BGA (Ball Grid Array) solder - The area ratio (%) of voids within the solder can be measured non-destructively from images obtained through X-ray transmission observation. ■ Cross-sectional observation of CSP (Chip Size Package) and BGA (Ball Grid Array) - Cross-sectional observation through mechanical polishing allows for the observation of defects such as shrinkage cavities that are difficult to see with X-ray observation. *For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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