McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications
McDermid Performance Solutions Japan Co., Ltd. Argomax
Enables the manufacturing of power modules with a Tjmax of over 200℃, contributing to improved reliability of chip bonding and overall cost reduction.
The lack of suitable solder materials has previously excluded high melting point lead-free solder from serious consideration, but this is finally changing. At the same time, there is a demand for bonding materials that can fully utilize the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. We are also focusing on the development of high thermal conductivity epoxy paste. The demand for improved reliability and cost-effective high-volume manufacturing (HVM) of die attach has never been higher. With environmentally friendly Argomax technology, we can create low-pressure sintered die attachments based on highly engineered particles. Argomax forms silver bonds with very high thermal and electrical conductivity, providing high reliability and flexible bonding lines. It enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and total cost reduction. It can also accommodate lead-free bonding for high-reliability applications. We offer a variety of pastes, films, and preforms tailored to specific applications.
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basic information
- Improved joint reliability: More than 5 to 10 times that of solder joints - Low-pressure sintering process: Improved yield - Shortening of the joining process: Increased productivity - Environmental considerations: Lead-free and improved energy efficiency
Price range
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Applications/Examples of results
Inverters for hybrid vehicles, EVs, power transmission, railways, etc.
Company information
The development of electronics has given people great dreams and has turned those dreams into reality one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and joyful to be engaged in a job that plays a part in this electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can contribute to the realization of humanity's great dreams and assist our clients in their product and information development. I sincerely hope to grow together with our clients in the information society of the 21st century. However, on the other hand, environmental issues have become a major focus. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental values of humanity. I am committed to striving towards becoming a company that harmonizes with nature and society as we move towards an endless future.
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