McDermid Solder Paste "ULT1 OM-220"
McDermid Performance Solutions Japan Co., Ltd.
It is suitable for various applications, such as products where substrates and components with low heat resistance may be implemented!
The solder paste "ULT1 OM-220" is a super low melting point product developed for mounting on substrates and components with low heat resistance. It allows for mounting at a peak temperature of 150°C or lower during reflow, enabling secondary mounting without re-melting the boards that have been mounted with "SAC305." This product is suitable for various applications, including consumer electronics, in-cabin automotive products, and medical products, where there is a possibility of mounting on substrates and components with low heat resistance. 【Features】 ■ Peak temperature during reflow: 150°C or lower ■ Mounting of low-cost substrates and components ■ Reduction of warpage of substrates and components during mounting <Compared to SAC (Sn/Ag/Cu) solder> ■ Excellent electrical reliability (cleared JIS Z 3197 and J-STD-0004B surface insulation resistance tests) ■ Low voids (satisfies IPC-7095 Class 3: BGA) *For more details, please refer to the PDF document or feel free to contact us.
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【Product Features (Partial)】 ■ Printing Process Window ・Printability ・Adhesion/Plate Life ・Printing Speed ■ Yield During Assembly ・Reflow Atmosphere ・Low Voids ・Reduced Solder Balls ■ Electrical Reliability ・IPC Surface Insulation Resistance Test ・JIS Surface Insulation Resistance Test ・Flux Classification ■ Environmental Aspects ・Halogen Content Rate *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The development of electronics has given people great dreams and has turned those dreams into reality one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and joyful to be engaged in a job that plays a part in this electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can contribute to the realization of humanity's great dreams and assist our clients in their product and information development. I sincerely hope to grow together with our clients in the information society of the 21st century. However, on the other hand, environmental issues have become a major focus. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental values of humanity. I am committed to striving towards becoming a company that harmonizes with nature and society as we move towards an endless future.
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