The solder particle diameter can be accommodated if it is a commercially available particle size! Introduction of solder transfer sheets.
"ATS" is a sheet that layers solder particles on a metal foil (etched aluminum foil or copper foil) substrate in a stacked manner. The composition involves stacking solder particles of a specified particle size in a single layer, two layers, or randomly in two to three layers on the substrate. In the case of a single layer, the solder particles are mechanically held in the pits of the etched aluminum substrate. For two layers or more, high boiling point solvents or high viscosity fluxes function as binders and are eliminated from the joint during solder melting. 【Features of the ATS Method】 ■ A technology with higher practical feasibility compared to considerations for miniaturization in ball mounting methods or paste printing methods. ■ Allows for easy transfer of solder particles without metal masks or alignment, regardless of electrode shapes such as concave or peripheral types. ■ Both powder transfer and molten transfer result in almost no voids. *For more details, please refer to the PDF document or feel free to contact us.
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【ATS Specifications】 ■1000S-EA-SAC ■2100S-CU-SAC ■1000M-EA-SAC ■2100M-EA-SAC ■1000M-EA-Bi ■2100M-EA-Bi *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company, with the main theme of "scientific exploration of heat and light," primarily operates in two divisions: the "Adhesives, Bonding, and Coatings Division" and the "Precision Printing Division," each producing reliable products using unique new technologies. We offer a wide range of electronics-related products, including dicing tapes for silicon wafers and quartz glass that utilize the loss of adhesion due to UV light, as well as heat-resistant products and precision printing products.