ウノン技研 List of Products and Services

"ATS" is a sheet that layers solder particles on a metal foil (etched aluminum foil or copper foil) substrate in a stacked manner. The composition involves stacking solder particles of a specified particle size in a single layer, two layers, or randomly in two to three layers on the substrate. In the case of a single layer, the solder particles are mechanically held in the pits of the etched aluminum substrate. For two layers or more, high boiling point solvents or high viscosity fluxes function as binders and are eliminated from the joint during solder melting. 【Features of the ATS Method】 ■ A technology with higher practical feasibility compared to considerations for miniaturization in ball mounting methods or paste printing methods. ■ Allows for easy transfer of solder particles without metal masks or alignment, regardless of electrode shapes such as concave or peripheral types. ■ Both powder transfer and molten transfer result in almost no voids. *For more details, please refer to the PDF document or feel free to contact us.

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"Fit Seal" is a type of inkjet printer-compatible label that can be printed using thermal transfer printers or home inkjet printers, and can also be handwritten with medium oil-based/water-based markers or ballpoint pens. It has excellent color reproduction, and the printed surface with water-based ink does not smudge even when wet. 【Features】 ■ Excellent color reproduction ■ Almost no smudging when wet ■ Strong adhesive power ■ Superior water resistance, heat resistance, and cold resistance ■ Flexible and elastic *For more details, please download the PDF or feel free to contact us.

• Safety and consumables