We utilize various sample processing techniques to provide rapid analysis results! Let us introduce our sample processing technology.
Foreign substances that significantly affect the yield of electronics products must be analyzed promptly. Our company provides rapid analysis results using various sample processing techniques. The materials introduce the excavation of foreign substances buried in multilayer films and an overview of micro cutting tools. 【Micro Cutting Tool Specifications】 ■ Cutting edge width: 50μm or 100μm ■ Cutting depth: approximately 2 to 300μm ■ Cutting targets: resin, glass, Si wafers, metals, etc. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Excavation of Foreign Objects Buried in Multilayer Films】 ■Foreign Objects in Multilayer Thin Films ■Cutting of Surface Layers ■Sampling FT-IR Analysis Transferred onto Si Wafer ■Moving Cutting Blade with Ultrasonic Vibration *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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