A compact tabletop device that takes up no space! No bubbles will form between the wafer and the film.
The "Vacuum Adhesive Device" is a product that uses a vacuum method to attach without air bubbles between the wafer and the film. It is a compact tabletop device that does not take up much space and does not require skilled operators. Additionally, it can be customized according to customer requests. 【Features】 ■ Tape application without air bubbles between the wafer and the film ■ Vacuum method for attachment ■ Compact tabletop device that does not take up much space ■ No need for skilled operators ■ Compatible with UV-curable film tape ■ Supports various films by changing the attachment unit *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Customization Examples】 ■ Compatible with wafer sizes of 8 inches or smaller ■ Development testing equipment for tape application and bonding for CDs and DVDs ■ Compatible with materials other than UV-curable film tape (materials that do not stretch and materials that require specific temperatures) ■ Bonding equipment for substrates with significant unevenness or warping, other than silicon wafers ■ Bonding equipment for small LCDs (12 inches or smaller) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
At Tohaki Seiko Co., Ltd., our main business is to enhance our production technology while providing proposals for increased productivity and environmental improvement to our customers, assisting them in improving production efficiency. We aim to be a unique company by selling our original developed products, which have emerged from our long-standing experience in the design, manufacturing, and sales of labor-saving devices across various devices. Please feel free to consult us when you have any requests.
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