Special Feature: Maximizing Inspection Efficiency! For those who want to achieve broad, detailed, and fast results.
CIS CoaXPress Camera Series - Camera Link Camera Series
A wide range of industrial cameras that are suitable for various needs such as labor-saving, reduced manpower, and increased productivity, capable of supporting high resolution and high-speed capture!
With the diversification of product needs in the market, there is a demand for inspection equipment/devices to diversify specifications, improve productivity, and shorten delivery times, in order to achieve labor-saving, reduce manpower, enhance productivity, and increase quality value by minimizing human errors. In addition to ensuring the accuracy of inspections, the recent miniaturization of IC products has led to higher resolution images being used for inspections, making the improvement of inspection speed and accuracy one of the challenges. CIS Corporation offers a wide range of industrial cameras capable of meeting diverse needs with high resolution and high-speed capture. We can propose the most suitable products for various applications, including inspections in semiconductor manufacturing processes such as wafer, wire bonding, and packaging, as well as electronic circuit board appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
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basic information
**Product Summary** ■VCC-25CXP1M Interface: CXP6×4lanes Sensor: APS-H type CMOS 4.5µm×4.5µm Effective pixel count: 5120 x 5120 Frame rate: 82fps (CXP6・8bit×4lanes), 65fps (CXP6・10bit×4lanes) Lens mount: M48 mount Dimensions/Weight: 65(W)×65(H)×65(D)mm ■VCC-50CXP1M *Under development Interface: CXP12・CXP6 Sensor: 35mm type CMOS 4.6µm×4.6µm Effective pixel count: 7920 x 6004 Frame rate: 30.5fps (CXP12×2lanes, CXP6×4lanes) Lens mount: M58 mount Dimensions/Weight: 65(W)×65(H)×93.3(D)mm
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Applications/Examples of results
Inspection at various stages of semiconductor manufacturing such as wafers, wire bonding, and packaging, as well as electronic circuit board appearance inspection (AOI), solder paste inspection (SPI), and also panel inspection, LED inspection, and electronic device inspection.
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Company information
CIS is a manufacturer of industrial imaging systems that consistently designs, manufactures, and sells various high-performance cameras, application products, and image processing IP. Our product applications span a wide range, including machine vision (MV), security, medical, broadcasting, intelligent transportation systems (ITS), construction machinery, and food and pharmaceutical inspections, boasting numerous OEM adoption achievements. Leveraging features such as compact size, high speed, high performance, high reliability, and high quality, we tackle advanced themes like the latest digital interfaces, camera signal processing algorithms, image processing applications, and intelligent cameras, continuously developing cutting-edge products. We focus on embedded image processing development and have developed the high-definition color image processing engine, Clairvu Engine. Additionally, we are advancing the commercialization of cameras that combine Clairvu Engine with 3G-SDI, HD-SDI, and CoaXPress, achieving successful adoption. Our licensing business for algorithms and image processing software has received numerous development commissions and is well-received in the broadcasting industry, medical device industry, and construction machinery applications. Furthermore, we offer custom-designed piezo stages cultivated through our experience with pixel-shift cameras.
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