Are you struggling to respond to issues related to temperature cycle testing of products? (Analysis) Vibration, shock, drop, durability.
The "Stress Simulation Service" uses a model that takes package structure into account to improve lifespan in temperature cycle testing. (Analysis) Vibration, impact, drop, durability In temperature cycle simulations, lifespan predictions are made considering the package structure, and improvement proposals aimed at reliability are suggested. Additionally, the vibration simulation addresses issues caused by vibrations during transport and operation, while the drop and impact simulation resolves problems related to drop impacts on semiconductor component connections. 【Features】 ■ Improvement of lifespan in temperature cycle testing using a model that considers package structure ■ Reduction of loss costs in the range of one million yen caused by additional prototypes and evaluations ■ Resolution of issues caused by vibrations during transport and operation (actual usage conditions) ■ Resolution of issues related to drop impacts on semiconductor component connections (solder) *For more details, please refer to the PDF document or feel free to contact us.
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As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.
