宇部エクシモ List of Products and Services

The "Compose(R) Pipe" is an extremely lightweight FRP scaffolding material, weighing about half that of a single pipe. It allows for a reduction in work time for assembly, disassembly, and lifting, significantly lowering transportation costs and contributing to CO2 reduction due to decreased loading weight during transport. Additionally, it produces low noise during loading, unloading, assembly, and disassembly, alleviating concerns about noise in urban areas or during nighttime work. 【Features】 ■ Extremely lightweight ■ Longer lasting compared to wood ■ Safe and efficient for work ■ Non-conductive ■ No electric sparks generated, etc. *For more details, please download the PDF or feel free to contact us.

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"Compose Butter(R)" is an FRP construction formwork column material made with UEXC's unique technology, featuring a lightweight and strong "FRP" with a special resin adhesive three-layer structure. It is highly resistant to water and seawater, with no concerns about rust, making it suitable for marine civil engineering. Additionally, it has excellent electrical insulation properties, eliminating worries about electric leakage accidents. 【Features】 ■ Weighs about half that of steel pipe butter, extremely lightweight ■ Reduces work time for assembly, disassembly, and loading ■ Significantly reduces transportation costs ■ Relatively easy to detach concrete and slurry ■ Due to the sealed ends, concrete and slurry do not flow into the pipe, etc. *For more details, please download the PDF or feel free to contact us.

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Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be processed in three dimensions, making it suitable for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ Three-dimensional processing is possible, allowing for the creation of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, resulting in good machinability. ■ It is suitable for chip-on-board (COB) mounting of bare chips. *For more details, please request materials or view the PDF data available for download.

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High Presica is a microparticle synthesized from high-purity silicon compounds. There are hard silica particles that excel in load resistance and soft organic-inorganic hybrid particles that do not scratch delicate substrates. The characteristics of High Presica include a very uniform particle size (monodisperse), a nearly spherical shape, and extremely high purity. Leveraging these features, it is used as a spacer in liquid crystal displays (LCDs) to maintain uniform thickness in the cells containing liquid crystal materials, making it an essential component for enhancing LCD resolution. Additionally, it is used in various fields such as spacers for adjusting adhesive layer thickness, high-performance resin fillers (for semiconductor encapsulation materials, etc.), and particles for high-performance film coatings. *For more details, please download the catalog.*

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