High-speed cutting with zero coolant! Dry processing scribe and break method.

Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.

Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates, which are layered with metal films or silicone resins on materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With its unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for a reduction in production costs due to the absence of water usage. 【Features】 ■ Stable and high-speed cutting processing is possible for many materials! ■ High-precision and high-quality cutting processing enables reduced street width and small size compatibility! ■ Compatible with various semiconductor/electronic component processing! ■ Also supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.

Waterproofing work