Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates, which are layered with metal films or silicone resins on materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With its unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for a reduction in production costs due to the absence of water usage. 【Features】 ■ Stable and high-speed cutting processing is possible for many materials! ■ High-precision and high-quality cutting processing enables reduced street width and small size compatibility! ■ Compatible with various semiconductor/electronic component processing! ■ Also supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.
Inquire About This Product
basic information
In the scribing process, minimal surface processing is applied to the planned separation line to form vertical cracks. It is compatible with both mechanical tool processing, such as wheels, and laser processing. In the breaking process, the back side of the scribe line is accurately and quickly pushed in with a break blade to extend the vertical cracks and achieve complete separation. ■ MDI's original tools ensure long life The ceramic tools developed with proprietary technology secure a scribing distance of over 1000 meters on hard alumina substrates. ■ MDI's special scribing function addresses substrate distortion It accommodates substrates that warp during firing processes, such as LTCC. It can follow distortions of 0.5 mm with high precision of ±30 μm for scribing. *For more details, please download the catalog or contact us directly.
Price range
Delivery Time
Applications/Examples of results
We support cutting processing of various semiconductors/electronic components. *For more details, please refer to the catalog.
Detailed information
-
MDI Original Tool Ceramic tool capable of scribing over 1000m
catalog（3）
Download All Catalogs
Company information
Samusung Diamond Industry is a manufacturer of processing equipment that provides optimal process conditions using original cutting edges and laser oscillators for processing methods such as scribing, breaking, drilling, and patterning, along with automated devices that achieve high productivity. Since its founding in 1935, the company has utilized its "high-quality cutting technology for various types of glass" to offer processing processes, equipment, and tools that can handle "all kinds of brittle materials, as well as multilayer structures including metals and organic materials." With solutions backed by theory and proven results, we aim to be a reliable "one-and-only partner" for our customers. Please feel free to contact us.