It is made of a very soft material, so it covers the contact surfaces of multiple parts with uneven attachment surfaces.
It is used by attaching a sheet to the heating element and closely adhering it to the heat dissipation element to conduct heat. It is used by placing it between the heating element and the heat dissipation element. It fills the gaps and unevenness between the heating element and the heat dissipation element, allowing for efficient heat transfer to the heat dissipation element. It exhibits high thermal conductivity while being electrically insulating and is a flexible thermal conductive material. Due to its very soft material, it reduces stress on the substrate and prevents adverse effects from excessive pressure on the semiconductor chip. It is a convenient single-sided adhesive type. Compliant with RoHS directives.
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basic information
It is an extremely soft, gummy-like, ultra-soft material. Model number: WW-GAP-B10A Dimensions: 100×100×thickness 1.0mm Thermal conductivity: 1.4W/m･K Hardness: 5 JIS Type E Specific gravity: 1.8 Volume resistivity: ≧1×10^10 Ω･cm Dielectric breakdown voltage: ≧10AC kV/mm Withstand voltage: ≧10AC kV/mm Operating temperature range: -40 to 150℃ Flame retardancy: V-0 UL94
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Applications/Examples of results
Thermal management of electrical components. Thermal management of circuit boards, etc. Heat dissipation measures for all heat-generating elements. Vibration suppression. Thermal management of computer CPUs.
Company information
Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent
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