Ideal for die attach in semiconductors and interconnection between modules and substrates.
The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.
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basic information
⚫︎ For semiconductor die attach (conductive) ... NIC BOND NB NB7000 NB7400 NB7401 NB7100 NB7500 NB7600 (PIN Transfer/RAPID CURE) NB8000 (high heat resistance) also offers insulating adhesives. ⚫︎ For IC Card Module ... NIC BOND NB700-5, NB7000 ⚫︎ Ultra-flexible, large area, compatible with a wide range of environmental specifications Premium Flex, Any Range Temp. ... NIC BOND NB9100Ag-6 * We also offer products for printing, stamping, and dispensing.
Price information
Sample 0 yen. Sample Free Please feel free to contact us.
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Applications/Examples of results
- Large to small IC chip - Conductive bonding of modules - Conductive bonding between substrates - IC card assembly - Bump/pad formation
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Company information
The Nichimori Business Division produces industrial and automotive "lubricants" that support the movement and safety of mechanisms in various aspects of daily life. Lubricants utilizing the properties of molybdenum disulfide, as well as special lubricants that do not use oil, are used in a wide range of applications including electronic devices, automobiles, and large machinery, supporting the smooth operation and safety of mechanisms. We are also developing new lubricants with consideration for environmental and human impact. Furthermore, we are engaged in the development of a wide range of products, including various chemical products and a spray cap that safely and easily removes residual gas, which has become a problem with the disposal of spray cans. Additionally, we aim to expand our business in various fields, including the supply of metallic molybdenum, molybdenum compounds, and adhesives for the electronics industry, as well as the sale of "wine," which can be considered a lubricant for humans. We provide special lubricants and high-performance adhesives.