Supports 2-inch wafer compatibility and precise photolithography processes.
This device is a dip coater that automatically performs the DIP/drying process for the purpose of thin film dip coating of multiple 2-inch wafers, metal plates, glass, etc., simultaneously with photoresist solution. It is a dip coater that applies the dip coating technology owned by SDI. It has a stroke of 290mm and is compatible with 2-inch wafers. It enables uniform resist film formation and supports the photolithography process for microfabrication. It is an ideal model for small-scale research and prototyping processes.
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basic information
【Main Specifications】 1. Stroke: 290mm 2. Target Size: 3.5 inch wafer 3. Target Materials: Wafer, metal, glass, etc. 4. Dip Speed: From 0.1mm/sec to 60mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: No 7. Filter Mesh: Yes 8. Drying Section: Yes 9. Drying Temperature: 100℃ 10. HEPA Unit: Yes 11. Equipment Size (Approx.): W:1800×D:1100×H:1850mm
Price range
P7
Delivery Time
Applications/Examples of results
Simultaneous thin film dip coating of photoresist solution on multiple 2-inch wafers, metal plates, glass, etc. It is used in semiconductor microfabrication experiments at research institutions and universities, as well as for resist coating in small-scale prototype lines.
Line up（10）
| Model number | overview |
|---|---|
| HC-1004 | Uniform application of hard coating material achieves excellent durability in film formation. |
| FA-0406 | Achieving precise resist coating on large-area substrates with fully automated control. |
| SA-1210 | Forming a uniform protective film with dedicated design for printed circuit boards. |
| SA-1407-S1 | Supports 2-inch wafer compatibility and precise photolithography processes. |
| SA-1503-S1 | A semi-automatic device that balances operability and precision, with excellent versatility. |
| SA-1509UL | UL-certified device equipped with a rotary mechanism capable of uniformly processing complex shapes. |
| SA-1712 | Achieving high-precision coating while minimizing liquid usage. |
| SA-1801 | Achieving high-precision processing by cleaning the surface of glass materials with ultrasonic cleaning. |
| SA-2203 | 4-inch wafer compatible, high-precision photoresist dip coater |
| SA-2210 | Mass production equipment that streamlines multilayer film formation with high-speed processing at 1000mm/sec. |
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