The rapid increase in data center power due to the expansion of generative AI. Organizing from a practical perspective the transition from air cooling to liquid cooling, cold aisle, water cooling in-row, and immersion cooling.
■Title: Heat Dissipation/Cooling Technology for AI Data Centers ■Date and Time: April 8, 2026 (Wednesday) 10:30 AM - 4:30 PM ■Target Audience for the Seminar Electronic equipment designers (assembly design, mechanical design, circuit design, PCB design), heat dissipation device/material developers, quality assurance, and quality control departments ■Knowledge Gained from the Seminar - Basic knowledge of heat transfer - Knowledge of heat dissipation in component and PCB design - Common methods for thermal design of forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc.
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■Event Details Date and Time: April 8, 2026 (Wednesday) 10:30 AM - 4:30 PM Participation Fee: 55,000 yen (tax included) * Includes materials * Our newsletter members (free registration) 49,500 yen (tax included) Method of Attendance: This seminar will be a live-streamed seminar using "Zoom."
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Participation fee: 55,000 yen (tax included) *Includes materials *For our newsletter members (registration is free): 49,500 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply at the same time and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.
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Our company monitors market trends for various chemicals, functional materials, and products, and conducts various market research, publishes market information, and supports research and development. Additionally, we also watch market trends in energy, batteries, various chemicals, functional materials, pharmaceuticals, and healthcare. We support research and development through commissioned research, publication of market information, and hosting technical seminars.
