Stress analysis case studies: temperature cycle, vibration, drop impact simulation.

We will not only provide temporary measures for the products with issues but also assist in reducing the development loss costs for the next development products!

In the "Temperature Cycle Simulation," we conduct life predictions through simulations that take package structure into account and propose improvement plans aimed at optimizing reliability. In the "Vibration Simulation," we analyze factors based on the product's mounting conditions (such as deformation of the housing during screw fastening) and propose countermeasures. In the "Drop and Impact Simulation," we perform factor analysis based on stress distribution using simulation techniques that consider package structure and propose countermeasures. With our proven track record in collaboration with semiconductor vendors, we have a deep understanding of package structures, which we leverage for consistency between simulations and actual measurements. We provide proposals for optimizing reliability based on the extensive knowledge of our specialized engineers in simulation, implementation, evaluation, and housing design. For more details, please download the catalog or contact us.

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