Gentle to the Earth, gentle to people.
We propose environmentally friendly lead-free solder backed by experience and technology!
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basic information
(Product Lineup and Main Features) 1. Solder Paste □ Compatible with fine pitch WCSP □ Water-soluble type and no-clean type 2. Flux □ A wide variety tailored to applications (BGA/CSP/F-chip) □ Usable in atmospheric conditions. 3. BGA Solder Ball □ Low melting point and high melting point types 4. Flux-cored Solder Wire □ Minimal flux spattering and reduced copper erosion on lead parts.
Price information
Prices vary depending on the quantity, so please feel free to contact us.
Delivery Time
Applications/Examples of results
(Main Uses and Examples of Achievements) □ Fine Pitch WCSP □ BGA □ F-chip, etc. We can provide products tailored to your needs through custom orders, so please consult us separately.
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Company information
Dai Nichi Shoji Co., Ltd. was founded in 1959 as an import trading company and has been providing products such as temperature sensors, plastic products, consumable materials, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, and established a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to respond quickly to customer needs and problem-solving, as well as our commitment to manufacturing. To survive in the rapidly changing electronics industry, we will continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.
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