We propose cost-effective product design and heat dissipation measures using the industry's first thermal analysis method!
Q) Are you spending a lot of money on heat dissipation measures for your products? Q) Are the heat dissipation measures implemented in your products reasonable? (Are they excessive?) "Our thermal analysis contract service will help reduce the costs associated with heat dissipation measures. We will determine the true thermal characteristics of the semiconductor devices, which are the heat sources, and propose heat dissipation measures that minimize temperature margins to the extreme. By combining the expertise of semiconductor engineers and thermal design engineers, we will derive the correct solutions using our unique technology (patent pending). [For more details, please download the catalog or feel free to contact us] ↓ ↓ ↓ ↓ ↓ ↓"
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basic information
I believe that the most important aspect of conducting thermal analysis is to accurately understand the thermal characteristics of the semiconductor, which is the heat source. So, is the thermal characteristic of the semiconductor obtained through actual measurements always correct? In general, the thermal measurement methods commonly used often fail to yield truly accurate values, and this fact is not widely known. By utilizing our services, which combine semiconductor technology and thermal analysis technology, we can derive the correct solutions and provide optimal thermal design proposals.
Price range
Delivery Time
P4
Applications/Examples of results
Thermal analysis and heat dissipation solution proposals for various embedded products such as automotive electrical components, LCD TVs, and embedded power supplies.
catalog（2）
Download All Catalogs![Heat Simulation [Flyer]](https://image.www.ipros.com/public/catalog/image/01/0f5/241260/IPROS29925472821478983831.jpeg?w=120&h=170)
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Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.