We provide bonding equipment that enables ultra-precision lap processing and polishing processing!!
In order to address the demands for microfabrication and the diversified ultra-high precision requirements sought in today's processing technology, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process that enables further precision pursuit while utilizing the current lap and polish processing line.
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basic information
【Features】 ○ A bonding device that corrects wafer warpage and minimizes the thickness of the wax layer to enable high-precision processing (creation) of ultra-thin wafers and precise control of wafer thickness. ○ By adopting air pressure (diaphragm method) for sample pressurization, it can uniformly apply pressure to the sample and correct wafer warpage on the supporting substrate without unevenness. ○ By adhering in a vacuum environment, it removes bubbles contained in the wax and air that may be mixed in when attaching warped wafers, ensuring high-precision bonding without thickness variation or insufficient adhesive strength due to bubble contamination in the wax layer. ● For more details, please contact us.
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Company information
With the arrival of a rapidly information-oriented society, the needs of society have become more diverse, and higher functionality and quality products are being demanded across all industries. In this context, we at Technolize have not forgotten our high goal of "providing precision beyond standards," which has been our motto since our establishment. We have developed various technologies across a range of devices and have provided products based on solid trust. Thanks to this, we have received high evaluations from customers in various fields, and we have gained significant trust for a wide range of products, including wrapping and polishing related equipment, semiconductor-related devices, flat and spherical polishing machines, various tools, as well as silicon wafers, environmental products, and optical communication related devices. As we enter the 21st century, expectations for ultra-high technology are increasing, and at the same time, there are still many challenges that companies will face in addressing environmental issues, reducing all costs, and improving business efficiency. Technolize aims to continue proposing better products and contributing to society in various ways.