Observation of substrate deformation using a 3D shape measurement device (VR-6200)

We would like to introduce the "substrate deformation observation" using a 3D shape measurement device.
By applying pressure to the PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement device (VR-6200).
Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
【Features】
■ Measurement results can be confirmed with a color palette and line profile
■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure

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