We will exhibit laser processing machines for file processing, flexible packaging, seal labels, and package manufacturing at JAPAN PACK 2023 (Japan Packaging Industry Exhibition) from October 3 to October 6.

Laser processing machine for flexible packaging film PACK MASTER. Die-cutless, 1,800mm width, 400m/min. Easy integration into existing production lines.

This is a proposal for laser processing on flexible packaging films used in food packaging and medical supplies. PACK MASTER has been developed to process flexible packaging films used in food packaging and medical supplies by cutting, slicing, creating windows, punching holes, half-cutting, and perforating, enabling new product proposals for easy opening, ventilation, and air circulation. ▼ Brand appeal and differentiation from competitors In recent years, product packaging plays an important role in promoting the brand strength of a company's products and differentiating them from competitors. This is especially true in the food and medical supplies industries, where packaging is developed to meet customer needs. We solve the challenges faced by flexible packaging film processing, achieving increased productivity, cost reduction, and sales expansion. ▼ Product features ■ Roll width: up to 1800mm ■ Maximum speed: 400m/min (200m/min during CW processing) ■ Easy integration into existing production lines ▼ Please refer to the PDF document [Guidebook] to understand PACK MASTER in 3 minutes. "What are the reasons that laser processing can achieve increased productivity, cost reduction, and sales expansion in flexible packaging film processing?"

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Overwhelming productivity of roll-to-roll! A proposal for a laser processing machine that can solve challenges from seal and label printing to post-processing with consistent digital processing.

The "LABEL MASTER" is a laser processing machine compatible with roll labels and stickers. It achieves overwhelming productivity and high-quality cuts with "die-cutless at 100m/min." It will assist in further improving the efficiency of small lot processing. The manufacturer, SEI, is recognized worldwide for its high technological capabilities, boasting sales of 300 units globally and 10 units domestically. The laser processing machine "LABEL MASTER" solves these challenges: ■ Equipped with the essential time-saving module for the digital age, "Auto Job Change." It reads printed QR codes and instantly changes processing data, enabling responsiveness to the increasing demand for small lots. ■ No need for die-related labor or costs. Laser processing does not require dies. This eliminates not only the manufacturing costs of dies but also the labor and costs associated with die sharpening, replacement, and management. ■ Capable of processing complex shapes that cannot be achieved with dies. Laser processing excels at handling intricate and fine shapes, allowing for work that was previously impossible with blades. *For more details, please refer to the catalog materials or proposal documents, or feel free to contact us.

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The crease revolution in cardboard packaging production! A new product, the Digital Die-Cut Crease System ORIGAMI, allows anyone to easily create crease plates.

The Crease Revolution in Cardboard Package Production! Anyone can easily create crease plates! The digital die-cut crease system 'ORIGAMI' has arrived! 'PAPER ONE' is a system suitable for digital compounding and finishing of sheet materials. It allows for creasing from either the front or back according to the specifications of graphics and designs. 【Features of ORIGAMI】 ■ Anyone can easily create crease plates just by importing the package layout data. ■ It operates offline, allowing for production without stopping the die-cutting and creasing processes on the laser machine. ■ Creasing is possible with a mix of mountain and valley folds. 【Features of PAPER ONE】 ■ It can sandwich with both male and female plates to perform creasing simultaneously. ■ A wide variety of laser cutting options are available, including full cuts, perforated cuts, and half cuts. ★ Please check the demo video for a complete overview of 'ORIGAMI' and 'PAPER ONE' ★ *For product specifications, please refer to the PDF document or feel free to contact us.*

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!