Solder Heat Resistance Test (SMD)

Our company conducts solder heat resistance tests to evaluate the heat resistance of surface mount devices (SMD) during the solder mounting process.
We replicate moisture absorption prior to mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during solder mounting.
Additionally, as part of the post-test inspection, we perform inspections similar to the initial measurements, and if necessary, we also conduct analyses such as cross-sectional observation of defective parts.
For more detailed information, please refer to the related products and catalogs.

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