Sputtering/Dual Chamber System [MiniLab-E080A/S060A]

Two thin film experimental devices are connected via a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected through the load lock. Thanks to Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below).
1. MiniLab-E080A (Evaporation Device)
- EB Evaporation: 7cc crucible x 6
- Resistance Heating Evaporation x 2
- Organic Evaporation Limit x 2
2. MiniLab-S060A (Sputtering Device)
- Φ2" Magnetron Cathode x 4 for simultaneous sputtering
- Compatible with both DC and RF power supplies
3. Load Lock Chamber
- Plasma Etching Stage
In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique 'soft etching' technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)


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This device is a semi-custom product. We provide estimates based on your specific requirements. For more details, please consult with us.