[Exhibition Report Released] We exhibited at TOKYO PACK 2022 (Tokyo International Packaging Exhibition).

Comnet Co., Ltd. exhibited at TOKYO PACK 2022 (Tokyo International Packaging Exhibition) held at Tokyo Big Sight from October 12 (Wednesday) to October 14 (Friday), 2022.
TOKYO PACK is one of the world's leading international comprehensive packaging exhibitions, covering all areas from procurement to production, logistics, distribution, sales, consumption, and disposal/recycling, focusing on packaging materials, containers, and packaging machinery.
Thank you very much for visiting our booth. Here is a brief exhibition report.
Event Dates: October 12 (Wednesday) to October 14 (Friday), 2022
Time: 10:00 AM to 5:00 PM (Visitor registration starts at 9:30 AM)
Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Halls East 1-3 and East 6
Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0064
Comnet Booth Number: 2-74
Exhibited Models by Comnet:
Laser processing machine for paperboard and packaging: SEI Series PAPER ONE
Laser processing machine for flexible packaging: SEI Series PACK MASTER (Sample display)
Laser processing machine for seals and labels: SEI Series LABEL MASTER (Live demonstration)
![[Exhibition Content and Highlights] Cost reduction and productivity improvement achieved without blade types.](https://image.www.ipros.com/public/news/image/1/f38/105376/IPROS15153646088605452766.jpeg?w=280&h=280)

Date and time | Wednesday, Oct 12, 2022 ~ Friday, Oct 14, 2022 10:00 AM ~ 05:00 PM (Event registration starts at 9:30) |
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Capital | Event Schedule: October 12, 2022 (Wednesday) to October 14, 2022 (Friday) Time: 10:00 AM to 5:00 PM (Visitor registration starts at 9:30 AM) Venue: Tokyo Big Sight (Tokyo International Exhibition Center) East Halls 1-3, 6 Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0064 Comnet Booth Number: 2-74 |
Entry fee | Free |
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