[Exhibition Participation Announcement] We will be exhibiting at the 37th NEPCON Japan - Electronics Development and Manufacturing Expo.

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We are releasing the UHF version of the HF shelf antenna, which has a sales record of over 2,000 units!

This is a shelf antenna system operating in the UHF band (920MHz). It allows for the bulk reading of books and equipment located on the shelf. By placing items with RF tags on the shelf antenna, it can be utilized for location management, inventory status tracking, and recording check-out and return histories. *UHF band RFID: Frequency 920MHz, International standard ISO/IEC18000-63, compliant with GS1 EPCglobal Gen2. Features: 1. UHF band RFID compliant with ISO/IEC 18000-63 and GS1 EPCglobal Gen2. 2. Type of specific low-power radio station that does not require a license application (output below 250mW). 3. One reader/writer can control up to 8 shelf antennas. 4. Location management for each shelf is possible. 5. Suppresses the spread of radio waves around the antenna to prevent misreads. 6. Installation on metal shelves is also acceptable. 7. Middleware for constant monitoring is available (sold separately). (*Direct control from the upper system without using middleware is also possible.) 8. The middleware includes a dashboard function bundled as a sample application.

• RFID/IC tags

You can easily implement inventory inspection for inbound and outbound processes using RFID.

This is a bulk check-in and check-out system for containers utilizing a radio wave shielding gate, using our company's UHF band RFID software package. The aluminum frame of the radio wave shielding gate is made from commercially available materials, achieving a cost approximately one-tenth that of a typical RFID gate. It is easy to install and move, making it applicable in various fields such as logistics, healthcare, manufacturing, and apparel. By attaching IC tags to the items being managed, check-in, check-out, and inventory record collection are realized using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer's side. 【Features】 ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of check-in, check-out, and inventory tasks. Additionally, operations can be tailored to the customer's environment and business, whether using handheld devices or gates. ■ IC Tag Issuance The package also includes an IC tag issuance function using an RFID-compatible label printer. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with Higher-Level Systems It integrates with higher-level systems via API or CSV, allowing for the RFID system to be implemented with a plug-in feel.

• Warehouse Management System (WMS)

Easily achieve constant monitoring with RFID! It enables real-time understanding of the inventory status and movement of managed items.

This is middleware for easily implementing a "constant monitoring RFID system" that automatically acquires the inventory and movement status of managed items. ■ Advanced Event Processing It processes the read IC tag data and databases the "inventory information" and "movement information" necessary for constant monitoring. ■ Easy Data Utilization The collected information is stored in a database, allowing users to easily access the necessary information whenever needed. (Database: PostgreSQL) ■ Centralized Management of Reader/Writers It supports multiple readers and multiple antennas, centrally managing various settings related to the reader/writer. The configuration of the readers and reading settings can also be easily performed from the screen.

• RFID/IC tags

The existing system remains unchanged! You can easily implement inventory inspection for inbound and outbound using RFID.

Attach IC tags to managed items and realize the collection of inbound and outbound inventory data using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer side. It integrates with upper systems via CSV or API, allowing for the introduction of RFID into existing WMS or core systems in a plug-in manner. This is a simple and easy-to-understand package specifically designed for RFID data collection. **Features** ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of inbound and outbound inventory operations. Additionally, operations can be tailored to the customer's environment and business needs, whether using handheld devices or gates. ■ IC Tag Issuance The package includes an IC tag issuance function using RFID-compatible label printers. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with Upper Systems It integrates with upper systems via API or CSV. Existing systems can remain unchanged while introducing the RFID system in a plug-in manner.

• Warehouse Management System (WMS)

The LF band (134.2 kHz) is an RFID system based on electromagnetic induction.

It is widely used for applications such as livestock and pet IDs, as well as semiconductor factories. We offer both built-in antenna stationary types and external antenna types. ーーーーーーーーーーーーーーーーーーーーーーーー More detailed information is available on the official website. Please be sure to check the link below. ーーーーーーーーーーーーーーーーーーーーーーーー

• RFID/IC tags

Reader/writer with touch panel that does not require a PC.

【Features】 　Built-in antenna 　LCD display with 2.8 inches (320×240d) touch functionality 　Standalone operation, no PC installation required 　Customizable touch panel display functionality 　Direct control of the reader/writer from a browser using web server functionality 　Supports MQTT as well

• RFID/IC tags

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!