Wave Technology List of Products and Services

In the "Temperature Cycle Simulation," we conduct life predictions through simulations that take package structure into account and propose improvement plans aimed at optimizing reliability. In the "Vibration Simulation," we analyze factors based on the product's mounting conditions (such as deformation of the housing during screw fastening) and propose countermeasures. In the "Drop and Impact Simulation," we perform factor analysis based on stress distribution using simulation techniques that consider package structure and propose countermeasures. With our proven track record in collaboration with semiconductor vendors, we have a deep understanding of package structures, which we leverage for consistency between simulations and actual measurements. We provide proposals for optimizing reliability based on the extensive knowledge of our specialized engineers in simulation, implementation, evaluation, and housing design. For more details, please download the catalog or contact us.

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In circuit design, high-speed and high-density transmission lines function as part of the circuit. Therefore, the analysis of transmission lines becomes important. As the speed and density increase, the electrical parameters of the transmission path become crucial. Depending on the analysis content and wavelength (λ) limitations, we will provide the necessary transmission line parameters while utilizing different tools. For more details, please download the catalog or contact us.

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If you do not understand the characteristics of diodes (PN junctions), which are often used as measurement elements, you may not be able to measure correctly. To accurately determine the package thermal resistance in a product environment, a technology that can evaluate thermal resistance analysis using actual devices with high precision is required. In a localized heating model, if a consistent model between actual measurements and thermal simulations has been created, the thermal resistance during arbitrary heating can be solved through simulation. Our company possesses the technology to uniquely design thermal resistance testing equipment, along with a comprehensive contract service from actual measurement to simulation. For more details, please download the catalog or contact us.

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By utilizing the electromagnetic field analysis simulator Q3D Extractor (Q3D), the quality of power line layout design can be enhanced. It also allows for design verification combined with waveform measurements. Improve quality with substrate design that considers low inductance for high current paths! Achieve efficiency improvements through feedback from switching waveform evaluations to substrate design! Increase reliability through improved consistency via actual measurements and simulation model fitting! For more details, please download the catalog or contact us.

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Our company provides design support based on a wide range of experience in semiconductor application products, from LSI to power electronics. In the power electronics field, exemplified by inverters, which has gained attention in recent years, solving challenges during switching is a key point. We can offer comprehensive design support, including transmission line analysis using electromagnetic field analysis simulators, product evaluation, and verification of circuit simulations.

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We will propose original equipment that fits the product genre and needs of our customers. Rather than just selling equipment, we will offer solutions based on semiconductor technology and thermal analysis technology, from optimal specification proposals to suggestions for measurement conditions.

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Q) Are you spending a lot of money on heat dissipation measures for your products? Q) Are the heat dissipation measures implemented in your products reasonable? (Are they excessive?) "Our thermal analysis contract service will help reduce the costs associated with heat dissipation measures. We will determine the true thermal characteristics of the semiconductor devices, which are the heat sources, and propose heat dissipation measures that minimize temperature margins to the extreme. By combining the expertise of semiconductor engineers and thermal design engineers, we will derive the correct solutions using our unique technology (patent pending). [For more details, please download the catalog or feel free to contact us] ↓ ↓ ↓ ↓ ↓ ↓"

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We can measure the surface temperature of LED chips with high precision using a contact method. By combining our developed high-speed temperature measurement system with custom thermocouples, we can measure the surface temperature of extremely small chips by specific areas. We offer a wide range of services, including evaluation contracts, system sales, and solution services that include thermal and stress simulations.

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- It is a system that can monitor the momentary disconnection of the conductive part with a resolution of 1μsec, in conjunction with the temperature cycle chamber. - It is utilized in connection reliability tests of semiconductor packages, among other applications.

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- In tests such as drop impact tests, where mechanical stress is applied at regular intervals, resistance value data is collected for 10 msec for each stress cycle (10,000 points at 1 μsec intervals). - In the standard configuration, it is possible to simultaneously collect, judge, and save data from up to 16 channels. - Instantaneous interruption detection and waveform information acquisition are executed simultaneously. - Collected list data and waveform data can also be analyzed using the included Viewer software. - Stress simulation services can also be proposed.

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Based on years of experience and achievements, we provide services focused on thermal analysis and thermal countermeasure proposals from the perspective of thermal design. We offer services backed by semiconductor device development and system equipment development. We provide a wide range of services from contracted analysis to the sale of measurement systems. (Thermal Simulation) [For more details, please download the catalog or feel free to contact us.]

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This system is characterized by high speed and stability. Sampling is represented at 10 msec intervals on the data, but the actual sampling interval is 50 μsec, achieving very high-speed sampling. By applying unique analysis processing, we have realized high speed and stability at 10 msec. The data stability is approximately ±0.05°C, making it an optimal system for users who desire both high speed and stability. By combining with custom thermocouples, the performance can be maximized (proposals can be made according to your needs).

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- A monitoring system that allows testing independent of the test chamber manufacturer. - An original data collection/analysis software that reflects the voice of our customers. We are utilized by many customers, including various manufacturers (semiconductors, electrical components, materials, resins), private and national research institutions, and contract testing companies.

• Analysis and prediction system
• Measurement and analysis equipment leasing and rental
• Other measuring instruments