SETO ENGINEERING List of Products and Services

In roll-to-roll web handling, we specialize in handling thin materials that are considered challenging and require low-tension transport. We can propose suitable winding/unwinding devices for various materials such as thick and thin materials, long and short lengths, resin films, and metal foils. We can also provide suggestions for various processing machines (laser, printing machines, sheet surface treatment devices), so please feel free to consult with us. 【Supported Materials】 ■ Material Types - Resin: PET, PI (Polyimide), PEN, etc. - Metal: Copper foil, aluminum foil, stainless steel, etc. - Others: Copper-clad laminate (CCL), aluminum composite materials, etc. ■ Material Width: 1mm to 1,200mm ■ Thickness: 10μm to 200μm *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Tabletop Roll-to-Roll Experimental Machine." With a compact design, it can be installed on laboratory workbenches or in draft chambers, and we can offer it at a low price due to a minimal equipment configuration. Thanks to the roll-to-roll processing technology we have developed over the years, the processing unit can accommodate a wide variety of treatments. Additionally, by swapping out the processing units, it can support various types of processing. We have a proven track record in the battery and 5G industries. 【Features】 - Compact design allows installation on laboratory workbenches or in draft chambers - Low-cost proposals possible due to minimal equipment configuration - A wide variety of treatments can be performed by exchanging processing units *For more details, please refer to the PDF document or feel free to contact us.

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This document introduces the plating process conducted using a roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, we explain the electrolytic plating. In the section on types of electrolytic plating, we also introduce the features, conditions, and challenges. As mentioned in "Plating Part 1," both electrolytic plating and electroless plating have their own characteristics, so it is necessary to choose a plating method that utilizes these features depending on the product being made. We encourage you to read it. *For more details, please refer to the PDF document or feel free to contact us.

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The company T, which manufactures film substrates, has been facing a significant challenge with the high electricity consumption of air compressors used in the air pipe for the liquid cutting process before drying in each surface treatment device, as they have been promoting eco-friendliness and energy saving in recent years. In response, we proposed our original air pipe designed and manufactured by our company. As a result, in the comparison of liquid cutting efficiency, our product achieved a flow rate of 356 L/min, while Company A's product had a flow rate of 568 L/min, resulting in a 37% reduction in usage for our product. As this result indicates, it is expected to lead to energy savings and cost reductions. [Effects] ■ In the comparison of liquid cutting efficiency, our product achieved a flow rate of 356 L/min, while Company A's product had a flow rate of 568 L/min, resulting in a 37% reduction in usage for our product. ■ It is expected to lead to energy savings and cost reductions. *For more details, please refer to the PDF document or feel free to contact us.

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This document introduces the transportation technology related to "roll-to-roll." There are multiple types of roll-to-roll transportation methods, and the appropriate method varies depending on the surface treatment involved. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

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This document introduces surface treatment technologies related to "roll to roll." Surface treatments are diverse, and it is essential to select the appropriate processing methods, transportation methods, and materials for each treatment accurately. We will introduce processing methods, transportation methods, and materials suitable for various surface treatments. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

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Company S manufactures substrates using a roll-to-roll method. When attaching and detaching reels that hold the substrates, the existing metal reel shafts caused metal foreign matter to be generated due to friction with the reels. This metal foreign matter frequently adhered to the substrates, leading to product defects, making improvement urgent. Therefore, we developed an air shaft that grips the reels, made of resin to prevent the generation of metal foreign matter and to prevent the reels from spinning freely. As a result, by adopting the resin air shaft, we were able to suppress the occurrence of metal foreign matter in this area. [Overview] ■ Background leading to the introduction - Product defects and performance degradation caused by foreign matter adhering to the substrates. ■ Solution - Development of an air shaft that grips the reels, made of resin to prevent the generation of metal foreign matter and to prevent the reels from spinning freely. *For more details, please refer to the PDF document or feel free to contact us.

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This document introduces reel shafts related to "roll to roll." The winding and unwinding reel shafts vary in shaft diameter depending on the base material, and the shape of the shaft also differs based on the fixing (chucking) method and the reel core. Please take a moment to read it. [Contents] ■ Winding and unwinding reel shafts ■ Dust prevention measures ■ Introduction to air shafts *For more details, please refer to the PDF document or feel free to contact us.

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This document introduces basic knowledge about "roll-to-roll." "Roll-to-roll" is a conveyance method that enables cost reduction, high productivity, continuous processing, and stable processing compared to traditional sheet-fed methods. Please take a moment to read it. [Contents] ■ What is roll-to-roll? ■ Basic knowledge of roll-to-roll technology *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our custom air shafts, the "RC Series," which we handle. Thanks to our unique technology, it is possible to incorporate SW (patent obtained). We will manufacture according to the specifications requested by our customers. These can be installed on TAB, COF, FPC-related devices, exposure equipment, printing machines, PR coating devices, developing equipment, etching devices, peeling devices, various plating equipment, various inspection devices, and more. 【Features】 ■ Main body materials: SUS, Ti, SS, MC nylon, peak material, etc. ■ Tip materials: SUS, Ti, SS, MC nylon, peak material, PP, etc. ■ Lug materials: SUS, Ti, SS, MC nylon, peak material (with surface urethane, etc.) ■ Chuck width: Compatible with a maximum width of 500mm ■ Main body surface treatment: Lathe processing, polishing, electro-polishing, Ti coating, peak coating, etc. *For more details, please refer to the PDF document or feel free to contact us.

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The "SK Series" is a standard resin air shaft that has successfully achieved an all-resin construction except for the mounting flange. There are two types available: one with a maximum load capacity of 30 kg for harsh environments, resistant to corrosion, called "3 inches," and another with a maximum load capacity of 10 kg, suitable for inspection machines, called "1 inch." These can be installed on TAB/COF related devices, exposure devices, printing machines, PR coating devices, developing devices, etching devices, stripping devices, various plating equipment, and various inspection devices. 【Specifications】 ■ Main body material: MC Nylon ■ Tip material: PP (Natural) ■ Lug material: MC Nylon ■ Chuck width: MAX 160mm / 105mm *For more details, please refer to the PDF document or feel free to contact us.

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The "Roll to Roll Etching Device" is a machine that continuously processes thin products without scratches or wrinkles using our transport technology. The transport speed is typically 5.0m/min. We will propose a device configuration tailored to the resin film materials (such as aluminum, copper, stainless steel, etc.) that you are targeting. 【Features】 ■ Device size: 15000mm(L) × 2100mm(W) × 2600mm(H) ■ Base material width: MAX 310mm ■ Processing steps: Unwinding ⇒ Etching processing ⇒ Cleaning ⇒ Drying ⇒ Winding ■ Transport speed: Typically 5.0m/min *For more details, please refer to the PDF document or feel free to contact us.

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The device is designed to perform copper plating tests on the product pattern sections of a film foil after undergoing pre-treatment, copper plating, rinsing, and drying processes, using a roll-to-roll vertical transport method for both sides of the product. The transport speed ranges from 0.1 to 0.5 m/min, with a maximum material width of 280 mm and a material thickness of 25 μm to 50 μm. The device consists of the following stages: unwinding, acidic degreasing, rinsing 1, feeding, acid activation, copper plating, recovery, feeding, rinsing 2, pure water wash, squeezing, air knife, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Processing surface: Both sides ■ Utilities: Power supply (AC 200・220V / 50・60HZ), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 5m (L) × 1m (W) × 1.3m (H) *excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.

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Our company employs vertical transport for electroplating, which excels in plating finish and maintenance. Additionally, by transporting in a U-shape, we can make the "roll-to-roll plating device" very compact, allowing us to provide equipment tailored to the desired size. Plating options include nickel, palladium, gold, copper, and more, all available upon consultation. 【Features】 ■ Vertical transport is adopted for electroplating ■ Excellent plating finish and maintenance ■ Equipment can be provided to match the desired size ■ Plating options include nickel, palladium, gold, copper, etc., available upon consultation *For more details, please refer to the PDF document or feel free to contact us.

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The "Roll to Roll Winding and Unwinding Device" is a machine that continuously processes thin materials using our transportation technology, ensuring they are transported without scratches or wrinkles. The transport speed is 9.0 m/min, and it can accommodate material widths up to 250 mm. The material thickness ranges from 25 μm and can be processed on one or both sides. By inserting various units between the unwinding and winding sections, it becomes a roll-to-roll device. 【Specifications】 ■ Lane Configuration: 1 Lane ■ Material Thickness: 25 μm and above ■ Device Configuration: Unwinding and Winding ■ Utility: Power Supply (AC 200/220V / 50/60Hz) ■ Dimensions: 3.0 m (L) × 1.2 m (W) × 1.7 m (H) *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Clean Inspection Machine," which allows for the management of cleanliness within the booth. By using an ionizer for static electricity elimination, we prevent dust adhesion. You can choose from two types of ionizers. Additionally, the air shaft is equipped with our "SK-1MNP-NN" as standard, which eliminates metal friction and prevents the adhesion of metal foreign objects. 【Features】 ■ Prevention of metal dust generation with the air shaft ■ Prevention of dust adhesion due to static electricity ■ Management of cleanliness within the booth ■ Ability to check particle conditions within the booth using a particle sensor ■ The air shaft comes standard with our "SK-1MNP-NN" (custom products are also available) *For more details, please refer to the PDF document or feel free to contact us.

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• Other measuring instruments

This product is a device for electroplating Ni+Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pre-treatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: one side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

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This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding, pretreatment, tin plating, post-treatment/water washing, rinsing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: Single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.

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This product is a device for stripping photoresist and backstop agents after etching. The transport speed is 2.0 m/min, and the material width is 35 mm to 160 mm for TAB/CSP/COF and 250 mm to 300 mm for FPC. The device consists of unwinding, stripping, rinsing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25 μm and above ■ Processing surface: Single-sided ■ Utilities: Power supply AC 200/220V, 50Hz/60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 16mL × 2.5mW × 2.5mH (excluding control panel and ancillary equipment) *For more details, please refer to the PDF document or feel free to contact us.

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The device continuously performs etching on thin sheet substrates such as FPC through roll-to-roll transport. The device consists of the following processes: unwinding (substrate loading) → laminating → etching → rinsing → acid washing → rinsing → winding (substrate peeling) → rinsing → drying → substrate stacking. In addition to the transport mechanism, it also precisely controls the temperature and pressure of the chemicals. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.5 m/min ■ Material width: MAX 350 mm ■ Material thickness: 50 μm and above ■ Processing surface: single side *For more details, please refer to the PDF document or feel free to contact us.

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The device is used for etching the surface of metal foils (such as aluminum). The transport speed is 5.0 m/min, and it can accommodate material widths of up to 310 mm. The device consists of a configuration that includes unwinding, etching processing, cleaning, drying, and winding. Using our low-tension transport technology, we can transport very thin and fragile materials without causing scratches or wrinkles, allowing for continuous processing. 【Specifications】 ■ Lane configuration: 1 Lane ■ Material thickness: 20 μm and above ■ Processing surface: Single-sided and double-sided ■ Utilities: Power supply (AC 200/220V / 50/60Hz), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 15 m (L) × 2 m (W) × 2.5 m (H) * Excluding control panel and ancillary equipment * For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Backstop Device" that coats the backside of TAB device holes with resist. The transport speed is 1.5m to 2.0m/min, and the material thickness is from PI 25μm. The device consists of unwinding, backstop coating, drying, and winding processes. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material width: For TAB/CSP/COF, 35mm to 160mm (none for FPC) ■ Processing surface: One side ■ Utility: Power supply AC 200V・220V / 50Hz・60Hz, heat exhaust ■ Device dimensions: 24mL × 1mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Developing Equipment." This device can perform developing processes after exposure of the wiring pattern. The processing surfaces are single-sided and double-sided. The device configuration includes unwinding, developing, rinsing, liquid removal, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Transport speed: 2.0 m/min ■ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ■ Material thickness: PI 25μm and above ■ Processing surfaces: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

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The device can coat photoresist on copper foil. The processing surfaces are single-sided and double-sided. It comes with roll coating method pre-treatment and drying. Additionally, the device configuration consists of unwinding, pre-treatment, PRC, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Transport speed: 2.0 m/min ■ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ■ Material thickness: PI 25μm and above ■ Processing surfaces: single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

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The device is capable of smoothing the front and back surfaces of copper foil. The lane configuration is 2 lanes, and the processing surfaces are single-sided and double-sided. The device configuration includes unwinding, electrolytic degreasing, acid washing, chemical treatment, acid washing, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 lanes ■ Conveying speed: 1.5m to 3.0m/min ■ Material width: For TAB/CSP/COF, 35mm to 160mm (For FPC, 250 to 300mm) ■ Material thickness: PI 25μm and above ■ Processing surfaces: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

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The device can perform copper plating on a "conductive ink" pattern formed in a resin film using an electroless method. Thin materials are transported without scratches or wrinkles using our company's transport technology. By adopting an UP/DOWN processing method for the processing section, it is possible to shorten the overall length of the device. 【Specifications】 ■Lane configuration: 1 Lane ■Transport speed: 0.5m/min (Max 1.5m/min) ■Material width: MAX 600mm ■Material thickness: 50μm and above ■Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

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The device can perform copper plating on the product pattern section. The process involves pre-treatment of the film foil, copper plating, rinsing, and drying, and is carried out in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the device, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). 【Specifications】 ■Lane configuration: 1 Lane ■Transport speed: 1.0m/min ■Material width: MAX 300mm ■Material thickness: 25μm to 50μm ■Processing surface: Both sides *For more details, please refer to the PDF document or feel free to contact us.

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The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (single side or both sides) *For more details, please refer to the PDF document or feel free to contact us.

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The device can generate a conductive coating inside the vias as a pretreatment for electroplating copper on blind vias and through holes. The processing surface is double-sided, and the power supply is AC 200V/220V / 50Hz/60Hz. The device configuration consists of unwinding, degreasing, micro-etching, activating, metallizing, stabilizing, pure water rinsing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.0m/min (depending on specifications) ■ Material width: 70mm to 160mm (for FPC 250 to 300mm) ■ Material thickness: PI 25μm ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.

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This product is a roll-to-roll cleaning device for film materials (film type). After rough cleaning and finishing cleaning, it dries and rewinds the material, and it is also capable of cleaning film materials with ITO film used in organic EL lighting. Additionally, the processing surface is double-sided. 【Specifications】 ■ Processing surface: Double-sided ■ Device configuration: Unwinding → UV cleaning → Brush cleaning (such as PVA) → Ultrasonic cleaning → Two-fluid cleaning → M/S cleaning → Rinsing with pure water → Liquid draining → Drying → Rewinding ■ Utilities: Power supply (AC200・220V/50・60HZ), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) *For more details, please refer to the PDF document or feel free to contact us.

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SETO ENGINEERING Co., Ltd. handles the "Desmia Device." This device can remove smears after drilling blind vias and through holes using laser drills and other methods. The line configuration is single-lane, and the processing surface is double-sided. The device configuration includes unwinding, degreasing, etching, neutralization and reduction, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Line configuration: 1 lane ■ Transport speed: 0.5 to 1.0 m/min (depending on specifications) ■ Material width: 70 mm to 160 mm (for FPC, 250 to 300 mm) ■ Material thickness: PI 25 μm and above ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.

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The "TAB・COF manufacturing device" can unwind product reels in sync with continuous transport without affecting line transport. The tension controller maintains a constant rotation speed for the product unwind reel. The tension at the unwind section can vary depending on the product width, but for a width of 96mm, transport is possible with less than 100g of tension. Additionally, in the tact transport method, products are fed using nip rollers or a single-axis robot for chucking, and for handling fine items, positioning is often achieved through an auto-alignment method using cameras. 【Features】 ■ Products can be continuously processed in units of several hundred meters at a constant speed under the same conditions. ■ Product quality, including yield, is improved. ■ Continuous flow of products eliminates the need for unnecessary transport fixtures. ■ It is possible to maximize the effective pattern area. ■ Effective utilization of materials is achievable, which is particularly advantageous in terms of cost. *For more details, please refer to the PDF document or feel free to contact us.

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