Device configuration for unwinding, applying backstop coating, drying, and winding! Backstop device with a transport speed of 1.5m to 2.0m.
We would like to introduce our "Backstop Device" that coats the backside of TAB device holes with resist. The transport speed is 1.5m to 2.0m/min, and the material thickness is from PI 25μm. The device consists of unwinding, backstop coating, drying, and winding processes. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material width: For TAB/CSP/COF, 35mm to 160mm (none for FPC) ■ Processing surface: One side ■ Utility: Power supply AC 200V・220V / 50Hz・60Hz, heat exhaust ■ Device dimensions: 24mL × 1mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the core technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a specialist group in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.