No scratches or wrinkles during transport! By adopting an UP/DOWN processing method in the processing section, it is possible to shorten the overall length of the device.
The device can perform copper plating on a "conductive ink" pattern formed in a resin film using an electroless method. Thin materials are transported without scratches or wrinkles using our company's transport technology. By adopting an UP/DOWN processing method for the processing section, it is possible to shorten the overall length of the device. 【Specifications】 ■Lane configuration: 1 Lane ■Transport speed: 0.5m/min (Max 1.5m/min) ■Material width: MAX 600mm ■Material thickness: 50μm and above ■Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■ Equipment Configuration: Unwinding → Pre-treatment → Copper Plating → Cleaning → Drying → Winding ■ Utilities: Power supply (AC200・220V / 50・60Hz) Pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Reference Equipment Dimensions: 15m (L) × 2m (W) × 2.5m (H) *Excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the core technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a specialist group in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.