KOHGAMI Corporation（神上コーポレーション） Company Profile

We will explain the content and details regarding waterproof specifications, as well as provide an overview of the testing process. Additionally, we will introduce related standards beyond just the IP code. We will discuss important waterproof structures necessary for achieving waterproofing, including enclosures and gaskets/seals, as well as waterproof membranes. Program: 1. Electronic Devices and Waterproof Standards 1-1. Electronic Devices and Waterproofing 1-2. Waterproof Standards 1-2.1. IP Code 1-2.2. Waterproof Standards within Various Regulations (ISO, JIS) 1-2.3. Waterproof Watch Standards 1-2.4. MIL Standards 1-3. Product Groups by Waterproof Standards 1-4. Testing Equipment by Waterproof Standards IPX5 IPX6 IPX9K 1-5. How to Obtain Waterproof Standards 1-5.1. Third-Party Testing Organizations 1-5.2. In-House Evaluation and Shipping Inspection: Air Leak Testing 1-6. Pitfalls of Waterproof Standards and How to Address Them 2. Main Waterproof Structural Design 2-1. Waterproof Enclosure Design 2-1.1. Gasket Structure 2-1.2. Seal Material/Tape Structure 2-1.3. Considerations for Insert Molding 2-1.4. Considerations for Two-Color Molding 2-2. Gasket, Seal, and Double-Sided Tape Design 2-2.1. Reference Values for Gasket/Seal Design 2-2.2. Selection of Waterproof Double-Sided Tape 2-3. Waterproof Membrane

Recently, the methods of "digital twin" and "metaverse" have been permeating the development field. These methods are highly compatible with the 3D-CAD, CAM, and CAE that we use daily, as well as large-scale structural environmental calculations, and they significantly contribute to front-loading during development and the sharing of information. They also prove effective in managing Q, C, D during development and total management. Moving forward, how we utilize this environment will become a challenge for us engineers. In this context, I would like to organize how to understand and utilize the metaverse, using the current state of manufacturing and CAE as examples, and how to incorporate it into our thinking. I hope this will assist in the rationalization and efficiency of work. ☆ Target audience: - Professionals with 2-3 years of practical experience in structural design - Practitioners engaged in CAE work - Managers in design and development departments - Administrators looking to improve their company's development processes through the metaverse ☆ Knowledge to be acquired after the course: - Understanding of "digital twin" and "metaverse" in the development environment - How to advance Q, C, D in development using the "metaverse"

Date and Time: August 25, 2023 (Friday) 13:00 - 17:00 Organizer: Nikkan Kogyo Shimbun Purpose of the Event The addition of waterproof functionality to electronic devices is not limited to equipment installed outdoors; it is also required for devices used daily, such as smartphones. With the recent IoT integration of various devices, the demand for waterproofing has further increased. To add waterproof functionality, it is essential to understand that the required waterproof standards and testing methods differ for each product. Additionally, when incorporating waterproof features, it is necessary to address challenges such as increased product costs and design constraints, as well as potential reductions in heat dissipation characteristics, which calls for early countermeasures through design front-loading. This seminar will explain the key points and tips for waterproof design through examples of waterproof design failures. Specifically, it will cover methods for considering waterproof structural design for electronic devices, the design of sealing components, heat dissipation design for waterproof enclosures, approaches to waterproof design using waterproof calculations and CAE, setting up air leak tests and countermeasures, and introducing a development process (design front-loading) that enables early countermeasures. Instructors well-versed in material development will impart knowledge on waterproof design failures and countermeasures from both waterproof structure and heat dissipation material perspectives.