Waterproof Design Methods and Defect Countermeasures in Electronic Devices: From Key Points of Waterproof Structural Design to Heat Dissipation Design of Waterproof Enclosures and Defect Prevention Measures.
KOHGAMI Corporation（神上コーポレーション）
Date and Time: August 25, 2023 (Friday) 13:00 - 17:00
Organizer: Nikkan Kogyo Shimbun
Purpose of the Event
The addition of waterproof functionality to electronic devices is not limited to equipment installed outdoors; it is also required for devices used daily, such as smartphones. With the recent IoT integration of various devices, the demand for waterproofing has further increased.
To add waterproof functionality, it is essential to understand that the required waterproof standards and testing methods differ for each product. Additionally, when incorporating waterproof features, it is necessary to address challenges such as increased product costs and design constraints, as well as potential reductions in heat dissipation characteristics, which calls for early countermeasures through design front-loading.
This seminar will explain the key points and tips for waterproof design through examples of waterproof design failures. Specifically, it will cover methods for considering waterproof structural design for electronic devices, the design of sealing components, heat dissipation design for waterproof enclosures, approaches to waterproof design using waterproof calculations and CAE, setting up air leak tests and countermeasures, and introducing a development process (design front-loading) that enables early countermeasures.
Instructors well-versed in material development will impart knowledge on waterproof design failures and countermeasures from both waterproof structure and heat dissipation material perspectives.
| Date and time | Friday, Aug 25, 2023 01:00 PM ～ 05:00 PM |
|---|---|
| Entry fee | Charge |
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