Waterproof Design Methods and Defect Countermeasures in Electronic Devices: From Key Points of Waterproof Structural Design to Heat Dissipation Design of Waterproof Enclosures and Defect Prevention Measures.

If you want to create water-resistant products, leave it to Marumaru Waterproof Services! We handle design, development, and improvements—everything is taken care of! Waterproof, water-resistant, dustproof, IPX.

Our company provides waterproof-related services such as establishing waterproofing for original products, adding waterproofing to existing products, and waterproofing non-waterproof products. By utilizing our waterproof technology, we can accommodate partial development and various process responses tailored to our customers' needs. We also support development that includes aspects beyond waterproofing. For original products, we offer design and technical proposals to establish waterproofing according to customer requests, achieving optimal waterproof performance. For existing products, we enhance waterproofing by applying waterproof treatments to existing products. Additionally, for non-waterproof products, applying waterproof treatments can expand possibilities for new applications and market development. Regarding estimates, we will respond carefully with content tailored to customer requests. Please feel free to contact us.

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This is the latest technological trend! A method to advance design and development one step further! - Metaverse × Digital Twin, waterproof structures for IoT, and analog solutions that are relevant now more than ever.

【Lineup】 - Waterproof Beginner: Understanding the basics of waterproof design - Waterproof Intermediate: Concrete waterproof design - Waterproof Beginner + Intermediate: A digest of beginner and intermediate - Process Improvement: Front Loading: Process for improving design quality - Thermal Countermeasures: Cutting-edge Hard Countermeasures: Practical heat dissipation methods as thermal countermeasures - Quality: On-site Practice: Understanding the true intentions behind quality responses - Digital Twin QCD: Understanding the QCD benefits of digital twins - Digital Twin Design Method: Digital Twin 3D design methods - Circuit Design: From Analog: Understanding circuit countermeasures from an analog circuit perspective - Understanding Drone Hardware: The forefront of drone development - CAE Method: FUSION360 (in planning): CAE methods from the perspective of FUSION360 - Waterproof Advanced: From 2025: Behind-the-scenes techniques of waterproof design - Design Standardization: Organizing design standardization - Framework in Design Development Process: Practical examples of frameworks used in development - CAD/CAE: CAD/CAE as foundational skills

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!