京浜ラムテック List of Products and Services

We would like to introduce our "SSW Tool Holder." Equipped with synchronous stirring joining technology, it achieves high-speed joining, high strength, and low-temperature joining. Your cutting machine will evolve. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed joining ■ High strength ■ Low-temperature joining *For more details, please refer to the PDF materials or feel free to contact us.

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We will introduce a comparison of the joining load between FSW and SSW. It is possible to reduce the vertical load applied during joining by more than 50%, and the required pressing pressure can be reduced to about half. Additionally, the joining load on the drive shaft side is approximately 3KN for FSW, while it is less than 1KN for SSW, resulting in a reduction to less than one-third compared to FSW. [Overview] ■ It is possible to reduce the vertical load applied during joining by more than 50% ■ The required pressing pressure can be reduced to about half ■ The joining load on the drive shaft side can be reduced to less than one-third *For more details, please refer to the PDF document or feel free to contact us.

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We have developed a Synchronized Stir Welding Tool Holder that far exceeds the general characteristics of FSW, which can be easily attached to the ATC of existing cutting machines without the need for dedicated FSW machines or FSW hybrid machines. It does not require a tilt angle and enables overwhelming "high-speed joining, high-strength joining, and low-temperature joining" compared to conventional FSW. It is utilized in various fields from the EV automotive industry to aerospace. Additionally, our R&D center is equipped with machining centers that have SSW Tool Holders, allowing us to model joining tools and propose joining parameters tailored to customer needs. 【Features】 ■ Synchronizes with the desired "direction and speed" of stirring, actively stirring the material ■ Joining speed is in the high-speed range ■ Joining with a small shoulder diameter is possible ■ Joining in a low heat input range is possible ■ A wide parameter range is achievable without the need for a forward angle (tilt angle) *For more details, please refer to the PDF document or feel free to contact us.

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Synchronized Stir Welding involves the joining tool tip performing "driving with slight vibrations" in both the tool's rotational direction and vertical direction. As a result, by synchronizing and stirring the tool in the "direction" and "speed" required by the material to be joined, this joining technology enables connections that surpass conventional concepts. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed joining ■ High strength ■ Low-temperature joining *For more details, please refer to the PDF document or feel free to contact us.

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We have developed the 'SSW', which demonstrates high performance simply by being mounted on the ATC of existing cutting machines, eliminating the need for dedicated FSW machines or FSW hybrid machines. It does not require a tilt angle and enables overwhelming "high-speed bonding, high-strength bonding, and low-temperature bonding." It is utilized in various fields, from the EV automotive industry to the aerospace industry. 【Features】 ■ Wide bonding range, making it easy to establish appropriate conditions for bonding ■ Low defect occurrence rate at the bonding site ■ Capable of obtaining advantageous setting condition ranges *For more details, please refer to the PDF document or feel free to contact us.

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At Keihin Ramtech, we have introduced FSW (Friction Stir Welding) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to provide consistent support from machining to assembly. If you have not adopted FSW before, please feel free to consult us for design support compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes with various materials and shapes. If you have any requests, please contact us. 【Features】 - Capable of achieving low-distortion joints by minimizing heat input during joining. - Specialized in joining difficult-to-weld materials, applicable to various materials. - Excellent joinability achieved through mechanical processes. *For more details, please refer to the PDF document or feel free to contact us.

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The RAM CATHODE dramatically improves the ionization rate by using a four-sided opposing target, enabling the formation of DLC (ta-C) with a DC pulse power supply without the need for HIPIMS power. 【Conventional Sputtering Method】 Due to the low ionization rate of carbon, it was necessary to use HIPIMS power to forcibly increase the ionization rate in order to obtain a hard ta-C region. 【RAM Cathode Developed by Our Company】 By arranging targets that face each other on four sides, the magnetic field between the targets enhances plasma confinement, allowing for the formation of high-density plasma. Within the confined plasma, electrons, rebounding argon, and Cflux repeatedly collide, promoting the ionization of Ar ions and Cflux, which facilitates the easy formation of C-C bonds in the DLC film. As a result, we have achieved the formation of high-hardness and high-smoothness DLC without using HIPIMS power. Additionally, since surface treatment is unnecessary, quality is improved, and time and labor costs can be reduced. *For more details, please refer to the PDF document or feel free to contact us.

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The RAM CATHODE (four-sided opposing cathode) dramatically improves the ionization rate, enabling the formation of DLC (ta-C) using a DC pulse power supply without the need for HIPIMS power. 【Conventional Sputtering Method】 Due to the low ionization rate of carbon, it was necessary to use HIPIMS power to forcibly increase the ionization rate in order to obtain the ta-C region. 【RAM Cathode Developed by Our Company】 By arranging targets on four opposing sides, the magnetic field between the targets enhances plasma confinement, allowing for the formation of high-density plasma. Within the confined plasma, electrons, rebounding argon, and C flux repeatedly collide, promoting the ionization of Ar ions and C flux, which facilitates the easy formation of C-C bonds in the DLC film. As a result, we have achieved the formation of high-hardness and high-smoothness DLC without using HIPIMS power. *For more details, please refer to the PDF document or feel free to contact us.

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This is a deposition-up horizontal inline sputtering device equipped with RAM cathodes (four-sided opposing low-damage sputtering cathodes) and strong magnetic field planar cathodes. To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. After that, high-speed deposition is performed with the strong magnetic field cathode. Each of the load lock stockers and unload lock stockers is vacuum-stored with 15 trays each. *For more details, please refer to the PDF document or feel free to contact us.*

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The RAM cluster sputtering system is a cluster-type sputtering device equipped with RAM cathodes (four-sided low-damage sputtering cathodes). To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. It has five expansion slots, allowing for the addition of sputtering chambers, deposition devices, glove boxes, and more. Additionally, it is equipped with a 25-stage multi-tiered load lock, enabling the automatic deposition of a wide variety of deposition recipes for each slot, making it suitable for all kinds of research and development.

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"PMC welding" differs from conventional MIG/MAG welding by forcibly cooling the molten pool through a special wire feeding control. By repeating this control, both welding speed and quality can be improved simultaneously. As a result, spatter is minimized to the extreme, allowing for a variety of joints, including MIG brazing and welding of 0.3 mm thin plates. [Features] ■ Significant reduction in heat input ■ Extreme reduction of spatter ■ Extremely stable arc ■ High-speed welding of thin aluminum plates is possible ■ Significant reduction in heat input *For more details, please refer to the PDF document or feel free to contact us.

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In conventional planar sputtering, significant damage is inflicted on the substrate, and in opposing sputtering, the film formation speed is slow, posing practical challenges. Our "RAM Cathode" has succeeded in generating dense plasma near the target surface by surrounding the target on all sides. By having argon ions strike the target with great force and vigor, we have resolved the issues that existed previously. 【Features】 ■ Reduces damage to the substrate by over 60% compared to conventional planar cathodes ■ Achieves film formation speeds more than three times faster than conventional opposing cathodes *For more details, please refer to the PDF document or feel free to contact us.

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Our company responds to customer needs with a rich lineup, including target materials, heaters, quartz glass, and other consumables. By applying our unique thermal analysis simulation technology, we achieve high cooling efficiency and more stable sputtering. We offer a wide range of support, from consultations and proposals for various processing and welding to sputtering targets for solar cells, LCDs (up to G10.5), and semiconductors, as well as surface treatments such as plating and blasting, annealing, cleaning of post-use protective plates, ultrasonic inspection of materials, tensile testing, and more. Please feel free to consult with us about anything. 【Product Lineup】 ■Backing plates for FPDs ■Backing plates for semiconductors ■Planar targets ■Quartz processed products ■Others *For more details, please refer to the PDF document or feel free to contact us.

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At Keihin Ramtech, we have introduced FSW (Friction Stir Welding) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to provide consistent support from machining to assembly. If you have not previously adopted FSW, please feel free to consult us for design support compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes with various materials and shapes. If you have any requests, please contact us. 【Features】 ■ Enables joining with minimal heat input and distortion during the process ■ Specializes in joining difficult-to-weld materials and can be applied to various materials ■ Achieves excellent joinability through mechanical processes *For more details, please refer to the PDF document or feel free to contact us.

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The semiconductor manufacturing process, which requires high purity and heat resistance, is one of the important application areas of "quartz glass." In recent years, automation in this field has progressed, and there is an increasing demand for higher precision products. Our processing technology responds to advanced requirements for essential components such as tubes and boats in CVD processes and oxidation/diffusion processes, further expanding application areas. 【Features】 ■ Wide wavelength range from ultraviolet to infrared ■ Good transmission characteristics ■ High thermal resistance, with a softening point of about 1700°C, usable at high temperatures up to 1000°C ■ Extremely low thermal expansion coefficient, allowing it to withstand rapid temperature changes ■ Excellent chemical resistance *For more details, please refer to the PDF document or feel free to contact us.

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"RAM Force" is a roll-to-roll sputtering device capable of depositing multilayer films such as optical films and metals onto plastic films. Not only can it evaluate the performance of the RAM cathode (low-damage cathode), but it also allows you to test your applications under lab conditions and transition from pilot lines to mass production lines. 【Features】 ■ Patent granted ■ Reduces damage to substrates by over 60% * Comparison between conventional flat sputtering and RAM cathode ■ Increases deposition speed by more than three times * Comparison between conventional opposing sputtering and RAM cathode ■ Unique technology from Keihin Ramtech * For more details, please refer to the PDF materials or feel free to contact us.

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FSW not only allows for the joining of non-ferrous metals with low melting points, such as aluminum and copper, but also enables the joining of materials with different properties. 【Features】 ■ Reduces distortion and deformation compared to fusion welding ■ Achieves joint strength close to that of the base material due to fine grain size ■ Compatible with difficult-to-weld materials such as Al, Mg, Cu alloys, Fe alloys (SUS), and dissimilar material joints *We will conduct joining tests with the materials you wish to join. For more details, please contact us or download the PDF to view.

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