三協 List of Products and Services

The "Electrode-less Discharge Lamp" 【MEXEL】 is a next-generation lighting suitable as an alternative to mercury lamps. By significantly reducing high frequencies that cause radio interference through circuit improvements, we have successfully controlled noise that causes issues like radio interference without lowering luminous efficiency. It is a product that offers safety and security. 【Main Features】 ■ Brightness comparable to mercury lamps ■ Energy-saving effect of about 1/3 to 1/2 compared to mercury lamps ■ Excellent color rendering with a color reproduction close to natural light (sunlight) ■ Long lifespan (approximately 10 times that of fluorescent lamps and about 5 times that of mercury lamps) ■ No filament electrodes, allowing for semi-permanent lighting (the brightness gradually decreases only due to the aging of the applied phosphor, but unlike other lighting, the lamp does not burn out) *For more details, please download the PDF document or feel free to contact us.

• lamp

At Sankyo Co., Ltd., we focus on three plating services: electrolytic hard gold plating, electrolytic soft gold plating, and electrolytic tin-copper plating. These services are primarily used for flexible printed circuit boards and printed circuit boards. 【Types and Features of Plating】 ● Electrolytic Hard Gold Plating - Excellent solderability - Superior corrosion resistance - High contact performance ● Electrolytic Soft Gold Plating - Excellent bonding and solderability High purity (99.99% or higher) and low hardness (90 Hv or lower) - Excellent uniform electrodeposition - Superior corrosion resistance ● Electrolytic Tin-Copper Plating - Environmentally friendly as it does not contain lead or fluorides (low pollution) - Excellent solderability due to stable coating characteristics (tin-copper ratio of 99:1) - Superior heat resistance and discoloration resistance 【Limited to first-time customers, we offer free evaluation samples up to 10 sheets!】 ◎ By downloading the catalog, you can view the company profile of Sankyo Co., Ltd. ◎ Please download the catalog to confirm the details of our technical analysis.

• others

The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is an alternative plating process that uses 4Ag, which has similar characteristics to Au, allowing it to be a substitute for the electroless Ni-P/replacement Au plating process. The solder wettability is better immediately after plating than that of the electroless Ni-P/replacement Au plating. For more details, please contact us or download the catalog.

• others

The 'Electrolytic Ni/Electrolytic Au Plating Alternative Plating Process' forms a dense and corrosion-resistant Pd coating between the electrolytic Ni plating and electrolytic Au plating, resulting in excellent corrosion resistance. The solder wettability immediately after plating is almost equivalent to that of electrolytic Ni/electrolytic Au plating. For more details, please contact us or download the catalog.

• others

The electroless Ni-P/replacement Au plating alternative plating process forms a dense and corrosion-resistant Pd coating between the electroless Ni-P plating and the replacement Au plating, resulting in excellent corrosion resistance. Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. For more details, please download the catalog or contact us.

• others

The plating with excellent solder wettability and a matte appearance is a replacement type Sn plating solution, which results in fewer pinholes and a uniform matte Sn coating simply by immersing copper. It has better solder wettability than electroless Ni-P/replacement Au plating. 【Features】 ○ As it is a replacement type Sn plating solution, fewer pinholes and a uniform matte Sn coating are deposited just by immersing copper. ○ Better solder wettability than electroless Ni-P/replacement Au plating. ○ Ideal for printed circuit boards (plated areas are copper). ○ Wide support from research and development to prototyping and mass production. For more details, please download the catalog or contact us.

• others

The new functional plating with excellent wear resistance and high hardness is a plating film that uniformly disperses and co-deposits silicon carbide (SiC) microparticles within an electroless Ni-P plating film. It can be used continuously for up to three turns depending on the replenishment method. 【Features】 ○ A plating film that uniformly disperses and co-deposits silicon carbide (SiC) microparticles within an electroless Ni-P plating film ○ Continuous use for up to three turns depending on the replenishment method ○ Ideal for sliding components ○ Wide support from research and development to prototyping and mass production For more details, please download the catalog or contact us.

• others