オジックテクノロジーズ List of Products and Services

Ojic Technologies' original plating technology "Niporin" is a multifunctional plating technology that combines both electroless nickel plating and PTFE functions. By incorporating PTFE as a composite particle, new functions are realized that metals and alloys alone could not achieve. Features of "Niporin": 1. Improved lubricity The friction coefficient is less than 1/5 of that of electroless nickel! 2. High water repellency About twice that of electroless nickel! 3. Uniform film thickness Since it is an electroless plating, it is possible to achieve a uniform film thickness unaffected by the shape of the item. 4. Wear resistance It is suitable for parts that undergo sliding motion. Additionally, the wear amount is about 1/3 of that of electroless nickel at most. 5. Suitable for food-related applications <Case Studies (Partial Content)> 【Improvement of lubricity】 - Improvement of sliding performance of equipment in clean rooms - Cases where equipment downtime on conveyor lines was eliminated 【Improvement of release properties】 - Reduction of maintenance man-hours for molds and jigs For more details, please download the PDF or contact us.

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"Electroless Ag plating" is a technology from Ozic Technologies that is compatible with next-generation SiC power devices. Conventional technologies have issues such as instability in operation under high-temperature environments and an inability to meet the demands for high-performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. [Features] ■ Achieves excellent performance as an alternative plating to Au, such as DIG (Direct Immersion Gold) ■ Maintains quality for a long time without being affected by the substrate (such as Cu) and without oxidation ■ Supports fine wiring patterns and partial plating by forming a uniform thin film (0.1~0.5μmt) *For more details, please refer to the PDF document or feel free to contact us.

• Special Construction Method
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Precision electroforming technology is one of the methods for manufacturing micro-mechanical components that are part of MEMS (Micro Electro Mechanical Systems). It accurately forms high-performance plating films on fine patterns created by photolithography technology. Our precision electroforming technology, unlike etching methods, can faithfully transfer high aspect ratio fine patterns in negative shapes and produce films of the specified thickness quickly and without defects. This time, we will introduce precision electroforming technology and related terminology. For more details, please contact us or download the catalog. E-mail: ogic@ogic.ne.jp Phone number: 096-352-4450

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This document is a glossary that includes terms such as electroforming, MEMS, aspect ratio, and others. "Electroforming" refers to the manufacturing, repair, or replication of metal products using an electroplating method. It is used for the production of replicas such as record and CD master discs, as well as for the manufacturing of molds and electroforming coatings. [Contents] ■ What is Electroforming? ■ What is MEMS? ■ What is stress? ■ What is aspect ratio? ■ What is photolithography? *For more details, please refer to the PDF document or feel free to contact us.

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Precision electroforming technology is one of the methods for manufacturing micro-mechanical components that are part of MEMS (Micro Electro Mechanical Systems). It accurately forms high-performance plating films on fine patterns created by photolithography technology. Our precision electroforming technology, unlike etching methods, can faithfully transfer high aspect ratio fine patterns in negative shapes and produce films of specified thickness quickly and without defects. We can prototype TEG patterns of trenches and holes with L/S=50/50 to 200/600μm, up to 4" wafer size. 【Main Features】 ■ Capable of producing thick films over 200μm ■ Achieves high hardness nickel plating (＞600Hv) ■ Electroformed films with low electrodeposition stress and minimal residual stress ■ Dense electroformed films without defects such as voids For more details, please contact us or download the catalog. E-mail: ogic@ogic.ne.jp Phone number: 096-352-4450

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The surface treatment "Niporin" is our original plating technology that combines the functions of electroless nickel plating and PTFE. By incorporating polytetrafluoroethylene (PTFE: fluororesin) as composite particles, new functions are brought out that metals and alloys alone could not possess. The friction coefficient is less than 1/5 of that of electroless nickel (compared to our standards), resulting in excellent slip properties. If you would like a sample, please contact us! *For more details, please refer to the PDF document or feel free to contact us.

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"Niporin" is our original plating technology that combines the functions of electroless nickel plating and PTFE. By incorporating polytetrafluoroethylene (PTFE: Teflon) as a composite particle, it not only achieves the corrosion resistance typically obtained from conventional plating but also brings out new functions that metals and alloys alone could not possess. - Hardness: Improved to approximately 550 Hv - Water contact angle: Improved water repellency to approximately 109° - Friction coefficient: Improved slip properties to less than 1/5 of that of electroless nickel (compared to our standards) *For more details, please refer to the PDF document or feel free to contact us.

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Even though it's called plating, there are various types of plating processes. Depending on the required application, environment, and the material being processed, it can be confusing to determine which plating process is best. In this document, we provide a simple explanation of plating processes through a four-panel comic. [Contents] - What is nickel plating? - What is zinc plating? - What is plastic plating? *For more details, please refer to the PDF document or feel free to contact us.

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"Niporin" is our original plating technology that combines the functions of electroless nickel plating and PTFE. By incorporating polytetrafluoroethylene (PTFE: Teflon) as a composite particle, new functions are derived that metals and alloys alone could not possess. The friction coefficient is improved to be less than 1/5 of that of electroless nickel (compared to our standards), resulting in excellent slip properties. 【Examples of Adoption】 1. Heater for Container Packaging The container packaging film was sticking to the heater (180°C), reducing production efficiency. ⇒ The film no longer sticks to the heater, leading to increased production efficiency. 2. Painting Jigs The paint adhered to the jigs and was difficult to remove, taking a lot of time for maintenance. ⇒ The paint is now easier to remove from the jigs, improving maintenance. 3. Semiconductor Manufacturing Equipment Oil cannot be used in clean rooms. ⇒ Since hardness and slip properties are maintained without using oil, the occurrence of contamination is reduced. *For more details, please refer to the PDF materials or feel free to contact us.

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"Odent processing" is an anti-static treatment that reduces the glass peeling charge phenomenon by applying a specially developed chemical etching and plating process. The secret to its anti-static effect lies in the fine, dense, and uniquely pointed structure on the surface of the aluminum component. This structure allows for point contact with the glass substrate, significantly reducing the true contact area. By decreasing the effective surface area involved in charging, the generation of static electricity is also minimized. [Features] ■ Anti-static effect due to corona discharge from the pointed structure ■ High durability with no degradation of effectiveness even after 300,000 contacts ■ High hardness comparable to hard chrome ■ No distortion during processing due to chemical treatment *For more details, please refer to the PDF document or feel free to contact us.

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Ojik Technologies' original plating technology "Niporin" is a multifunctional plating technology that combines the functions of electroless nickel plating and PTFE. By incorporating PTFE as a composite particle, new functions are brought out that metals and alloys alone could not possess. Features of "Niporin": 1. Improved Slipperiness The friction coefficient is less than 1/5 of that of electroless nickel! 2. High Water Repellency About twice that of electroless nickel! 3. Uniform Film Thickness As it is an electroless plating, it is possible to achieve a uniform film thickness unaffected by the shape of the item. 4. Wear Resistance It is suitable for parts that undergo sliding motion. Additionally, the wear resistance is about 1/3 of that of electroless nickel. 5. Proven Track Record for Medical Treatment Instruments <Case Studies (Partial Content)> [Improvement of Slipperiness] - Improvement of sliding performance of devices in clean rooms - Cases where equipment downtime on transport lines was eliminated [Improvement of Release Properties] - Reduction of maintenance man-hours for molds and jigs For more details, please download the PDF or contact us.

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We would like to introduce a case study of our developed heat-resistant anodizing treatment for aluminum components, called "Welmite." We received a request from a customer stating that various parts (anodized products) in the processing chamber of a semiconductor manufacturing equipment heat treatment module were corroding due to the volatility of solvents and developing solutions. In response, we developed "Welmite" to solve the customer's issues. After its adoption, the lifespan of the parts was significantly extended, and the yield of the semiconductors improved. 【Case Study】 <Customer's Request> ■ Various parts in the processing chamber of the semiconductor manufacturing equipment heat treatment module are corroding due to the volatility of solvents and developing solutions. ■ To prevent the deterioration of semiconductor yield, frequent parts replacements are necessary, leading to concerns about running costs. <Feedback from the Customer After Adopting Welmite> ■ The lifespan of the parts has been significantly extended, and the yield of semiconductors has improved. ■ Not only has it been appreciated by users, but it has also contributed to enhancing the added value and competitiveness of the equipment. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce a case study of the anti-static treatment "Odent Treatment," which reduces the glass peeling and charging phenomenon. In the manufacturing process of liquid crystal devices, we received inquiries from customers who place glass substrates on a mounting table (made of aluminum) and perform various treatments. They reported, "During processing, the substrate becomes charged and sticks to the mounting table, and when trying to detach the glass substrate from the mounting table after processing, the glass substrate breaks, or semiconductor devices are damaged due to electrostatic discharge, which is a problem for us." The solution that met this requirement was the anti-static treatment technology "Odent Treatment," which does not require decharging equipment on the mounting table. After its adoption, the substrates no longer broke, resulting in improved yield in the manufacturing process. [Case Study] <Customer Inquiry> ■ The substrate becomes charged and sticks to the mounting table during processing, and when trying to detach the glass substrate from the mounting table after processing, the glass substrate breaks or semiconductor devices are damaged due to electrostatic discharge, which is a problem for us. <Feedback from Customers After Adopting Odent> ■ The substrates no longer break, leading to improved yield in the manufacturing process. ■ We have been using it for several years, and the performance is still sustained. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce a case study of our original plating technology "Niporin," which combines the functions of non-electrolytic nickel plating and PTFE. We received an inquiry from a customer stating, "The gears that slide in the semiconductor manufacturing equipment in the clean room are not sliding properly." The solution that met this requirement was the multifunctional plating "Niporin," which has various advantages such as release properties and water repellency. After its adoption, smooth sliding motion became possible without the use of lubricating oil. [Case Study] <Customer Inquiry> ■ The gears that slide in the semiconductor manufacturing equipment in the clean room are not sliding properly. ■ Lubricating oil cannot be used in the clean room, and we do not know how to resolve this issue. <Feedback from the customer after adopting Niporin> ■ Smooth sliding motion became possible without the use of lubricating oil. *For more details, please refer to the PDF document or feel free to contact us.

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"WELMITE" is a heat-resistant anodizing treatment developed in-house (anodic oxidation treatment of aluminum components). Typical anodized coatings can crack due to differences in expansion caused by the disparity in thermal expansion coefficients between the anodized layer and the aluminum substrate. This coating structure aims to alleviate the differences in thermal expansion, and no cracks occur even in a 200°C cycle test. In applications where parts such as semiconductor device components or automotive parts may become heated, it is possible to prevent surface cracking due to thermal history. We have included examples in our materials that demonstrate improvements in yield for semiconductor manufacturing equipment exposed to an installation temperature of 180°C. For more details, please refer to the PDF materials or feel free to contact us.

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"Odent processing" is an anti-static treatment that reduces the glass peeling and charging phenomenon by applying a proprietary specialized chemical etching and plating process. The secret to the anti-static effect lies in the fine, dense, and specially pointed structure on the surface of the aluminum component. This structure allows for point contact with the glass substrate, significantly reducing the actual contact area. By decreasing the effective area involved in charging, the generation of static electricity is also minimized. [Features] ■ Anti-static due to corona discharge from the pointed structure ■ High durability with no degradation in effectiveness even after 300,000 contacts ■ High hardness comparable to hard chrome ■ No distortion during processing due to chemical treatment *For more details, please refer to the PDF document or feel free to contact us.

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A simple explanation of nickel plating, zinc plating, and plastic plating in manga! Even when it comes to plating, there are various types of plating processes. Depending on the required application, environment, and material being processed, it can be confusing to determine which plating process is best. "Electroless Ag plating" is a technology from OJIC Technologies that is compatible with SiC power devices. Conventional technologies have issues such as instability in operation under high-temperature environments and an inability to meet the demands of high-performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high-melting-point metal bonding with Ag nanoparticles. 【Features】 ■ Achieves excellent performance as an alternative plating to Au such as DIG (Direct Immersion Gold) ■ Maintains quality for a long time without being affected by the substrate (such as Cu) and without oxidation ■ Forms a uniform thin film (0.1~0.5μmt), making it suitable for fine wiring patterns and partial plating *For more details, please refer to the PDF materials or feel free to contact us.

• Special Construction Method
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The "precision electroforming" technology is a method for manufacturing micro-mechanical components that are essential elements of MEMS (Micro Electro Mechanical Systems). It accurately forms high-performance plating films on finely patterned structures created by photolithography technology. It can be combined with our original product NIPOLYN and plating, offering a wide variety of options such as trench and hole filling. 【Features】 ■ Capable of producing thick films over 200μm ■ Achieves high hardness nickel plating (＞600Hv) ■ Electroformed films with low residual stress due to low electrodeposition stress ■ Dense electroformed films without defects such as voids ■ Excellent processing precision *For more details, please refer to the catalog or feel free to contact us.

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OGEP-V3 processing is an electrolytic polishing method that can be applied to aluminum and stainless steel chambers (austenitic and martensitic). It can be used for semiconductor manufacturing equipment parts and has the effect of suppressing the release of gases generated during vacuum conditions in vacuum devices. While electrolytic polishing generates corrosive "sulfur gas," OGEP processing does not produce this gas. There are two types of OGEP processing: "OGEP-Al" for aluminum and "OGEP-SUS" for stainless steel. Keywords: electrolytic polishing, sulfur, sulfa, gloss, leveling, corrosion resistance, burr removal, burn removal, precision cleaning, smoothness. ● For more details, please contact us. E-mail: ogic@ogic.ne.jp Phone number: 096-352-4450

• Aluminum Mirror
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"WELMITE" is a heat-resistant anodizing treatment developed in-house (anodic oxidation treatment of aluminum components). In general, anodized coatings can crack due to differences in elongation caused by the disparity in thermal expansion coefficients between the anodized layer and the aluminum substrate. This coating structure aims to alleviate the differences in thermal expansion, and no cracks occur even in a 200°C cycle test. When parts such as semiconductor device components or automotive parts become heated, it can prevent surface cracking due to thermal history, among other applications. 【Features】 ■ No cracks occur even at 200°C ■ Excellent heat resistance ■ Reduced particles ■ Improved corrosion resistance *For more details, please refer to the PDF document or feel free to contact us.

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Ojic Technologies Co., Ltd. conducts various surface treatments for semiconductors, electrical and electronic components, automotive parts, production equipment parts, and other items that support modern society. We offer a wide range of services tailored to customer needs, from general plating that requires rust resistance and corrosion resistance to high-performance plating that demands wear resistance, heat resistance, and lubrication properties, as well as plating for difficult materials such as ceramics, environmentally friendly plating such as lead-free and hexavalent chromium-free options, and antibacterial plating. 【Original Surface Treatments】 ■ Precision Electroforming ■ Odent Treatment (Static Electricity Prevention Treatment) ■ Nipolin Treatment (PTFE Composite Treatment) ■ Ojip Treatment (OGEP Treatment, Electrolytic Polishing) and more For more details, please contact us or download our catalog.

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"Odent processing" is an anti-static treatment that reduces the glass peeling charge phenomenon by applying a specially developed chemical etching and plating process. The secret to its anti-static effect lies in the fine, dense, and uniquely pointed structure on the surface of the aluminum component. This structure allows for point contact with the glass substrate, significantly reducing the actual contact area. By minimizing the effective surface area involved in charging, the generation of static electricity is also reduced. [Features] ■ Anti-static effect due to corona discharge from the pointed structure ■ High durability with no degradation of effectiveness even after 300,000 contacts ■ High hardness comparable to hard chrome ■ No distortion during processing due to chemical treatment *For more details, please refer to the PDF document or feel free to contact us.

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"Niporin" is our original plating technology that combines the functions of electroless nickel plating and PTFE. By incorporating polytetrafluoroethylene (PTFE: Teflon) as a composite particle, new functions are brought out that metals and alloys alone could not possess. The friction coefficient is reduced to less than 1/5 of that of electroless nickel (compared to our standards), resulting in improved slip properties. [Features] ■ High water repellency ■ Uniform film thickness ■ Wear resistance ■ Improved slip properties *For more details, please refer to the PDF document or feel free to contact us.

• others

Precision electroforming technology is one of the methods for manufacturing micro-mechanical components that are part of MEMS (Micro Electro Mechanical Systems). It accurately forms high-performance plating films on fine patterns created by photolithography technology. Our precision electroforming technology, unlike etching methods, can faithfully transfer high aspect ratio fine patterns in negative shapes and produce films of specified thickness quickly and without defects. We can prototype TEG patterns of trenches and holes with L/S=50/50 to 200/600μm, up to 4" wafer sizes. 【Main Features】 ■ Capable of producing thick films over 200μm ■ Achieves high hardness nickel plating (＞600Hv) ■ Electroformed films with low residual stress due to low electrodeposition stress ■ Dense electroformed films without defects such as voids For more details, please contact us or download the catalog. E-mail: ogic@ogic.ne.jp Phone number: 096-352-4450

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This is a coating suitable for various electronic component contacts and decorative parts.

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We will perform the removal of welding discoloration and surface cleaning.

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This is a coating suitable for semiconductor manufacturing equipment parts, mechanical parts, and chemical contact areas.

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This is a coating suitable for corrosion protection of mechanical parts, semiconductor manufacturing equipment, exterior parts, and improving wear resistance.

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