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Introducing "Electrolytic Polishing Process for Metal Masks." By applying electrolytic polishing treatment to SUS plates after opening processing, it is possible to smooth the unevenness of the inner walls of the openings. This treatment ensures stable and good solder printability for components such as QFPs and BGAs with a 0.4mm pitch, as well as 0603 chip components. Our technology supports the resolution of quality issues and enhances quality. [Features] - Improved release of cream solder - Ability to smooth the unevenness of the inner walls of the openings - Ensures stable and good solder printability *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationFPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.
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Free membership registrationIt is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.
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Free membership registrationIt is a substrate with copper foil on both sides of a glass epoxy insulating board.
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Free membership registrationThis is a substrate with copper foil on only one side of a paper phenol or glass epoxy insulating board. There is no copper foil on the walls of the holes. (It is produced using the line from the first factory.)
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