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It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.
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basic information
【Features】 ○ The internal copper foil is bonded together by pressing. ○ Similar to double-sided boards, it is possible to connect between the two sides and the inner layers by plating copper foil on the walls of the holes. ○ A photolithography method using liquid photoresist is employed. ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○ Various wiring boards ● For other functions and details, please contact us.
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Company information
At Tokai Shin'e Electronics Co., Ltd., we carry out all processes in-house to provide high-tech products and quick responses, delivering the highest level of satisfaction to our customers.