Electropolishing process in metal masks

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last updated：Jul 03, 2023

東海神栄電子工業

Official site

Improving the release properties of cream solder! We support the resolution of quality issues and enhance quality.

Introducing "Electrolytic Polishing Process for Metal Masks." By applying electrolytic polishing treatment to SUS plates after opening processing, it is possible to smooth the unevenness of the inner walls of the openings. This treatment ensures stable and good solder printability for components such as QFPs and BGAs with a 0.4mm pitch, as well as 0603 chip components. Our technology supports the resolution of quality issues and enhances quality. [Features] - Improved release of cream solder - Ability to smooth the unevenness of the inner walls of the openings - Ensures stable and good solder printability *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.tsk-pcb.co.jp/product/stencils/

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basic information

【Features of Metal Masks】 ■ By drilling holes in stainless steel and allowing cream solder to drop into those holes, it is possible to apply solder only to the land positions on the circuit board. ■ There are three types of opening methods: "laser processing," "etching processing," and "additive processing." *For more details, please refer to the PDF document or feel free to contact us.