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  3. MARUWA 本社,東京支店,関西支店,東北営業所,北信越営業所,九州北営業所,R&Dセンター
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MARUWA 本社,東京支店,関西支店,東北営業所,北信越営業所,九州北営業所,R&Dセンター

EstablishmentApril 5, 1973
capital864672Ten thousand
number of employees1309
addressAichi/Owariasahi-shi/3-83 Nanbontokihara-cho
phone0561-51-0842
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last updated:Feb 14, 2024
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MARUWA List of Products and Services

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Ceramic valve

Ceramic valve

MARUWA's ceramic valves are designed to accommodate not only valves but also other sliding components, thanks to their surface polishing technology that excels in sliding properties. They possess strength and wear resistance second only to diamond, along with excellent chemical resistance that is not affected by acids or alkalis. Ceramic application products produced using unique materials and molding methods achieve high performance and high reliability through years of accumulated dry press ceramic technology.

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Ferrite magnet (magnet)

Ferrite magnet (magnet)

MARUWA's ferrite magnets are ferrite-based magnets characterized by high magnetic retention, widely used for communication devices, motors, suction applications, relays, and various sensors. At MARUWA, ferrite magnets are produced in a consistent process from material to magnetization. They are primarily used in automotive products and magnetic medical products, as well as in various sensors.

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Antenna block, substrate

Antenna block, substrate

Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is available according to size, shape, and other requirements. They are used for car navigation systems, antennas for mobile phones, and Bluetooth. Circuit boards for GPS antennas for car navigation are manufactured in sizes of 25mm square and 20mm square. Circuit boards for GPS antennas for mobile phones are produced in sizes of 9 to 12mm square. Circuit boards for isolator capacitors are available in a 50mm square size with various materials.

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Dielectric resonator (TE, TM modes)

Dielectric resonator (TE, TM modes)

It is used for base stations of mobile phones, satellite communications, etc. We can accommodate both TE modes that require high Q values and TM modes that can be miniaturized. Using our accumulated molding and processing technology, we can also produce complex shapes.

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Coaxial resonator (TEM mode)

Coaxial resonator (TEM mode)

Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is possible according to size, shape, and other requirements. They are used in bandpass filters (BPF) and voltage-controlled oscillators (VCO). High dry pressing molding technology and high-precision processing technology achieve stable frequencies.

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Alumina laminated substrate/package (HTCC)

Alumina laminated substrate/package (HTCC)

Due to the layered structure, free wiring routing is possible. Additionally, CAVTY structure is also possible, allowing for complex configurations.

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AlN laminated substrate/package

Package composed of high thermal conductivity AlN material.

Due to its layered structure, free wiring routing is possible. Additionally, cavity structures can be implemented to accommodate complex designs. It is a package made of high thermal conductivity AlN material that can dissipate heat when high-heat-generating chips are mounted.

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Thick film metallized substrate/package (plating specification)

The fusion of ceramic materials and long-developed thick-film metallization technology.

Thick-film metallized substrates are substrate materials created from the fusion of various proven ceramic materials and the thick-film metallization technology developed over many years. They can be customized using a variety of pattern formation techniques and are used in applications such as semiconductor lasers and medical lasers.

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Thick film metallized substrate/package (printing specifications)

This is a substrate printed with thick film circuits using alumina and aluminum nitride substrates that excel in thermal conductivity, and it has been sintered at high temperatures.

This is a substrate made by printing thick-film circuits using alumina and aluminum nitride substrates with excellent thermal conductivity, and then firing it at high temperatures. The surface allows for the formation of electrodes, enabling the realization of compact and multifunctional substrates. Additionally, the via structure allows for conductivity between the front and back sides.

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Ceramic airtight terminal

Ceramic airtight terminal

In recent years, devices related to electronic equipment have been strongly required to be applicable in high vacuum environments, as well as to be fine and highly precise. Consequently, the materials used in products are being transitioned from resins and glass to ceramics in response to the demand for improved quality. Our ceramic hermetic terminals utilize ceramics (such as Al2O3) as insulating and hermetic materials, maintaining hermeticity in high vacuum environments, alleviating concerns about aging degradation, and enhancing applicability and reliability in high-temperature environments. As a result, they are widely used in equipment and facilities in fields such as space, medical, and nuclear power, where high vacuum and high pressure compatibility is particularly required.

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Aluminum nitride filler

Aluminum nitride filler developed by applying technology cultivated in ceramic substrates, featuring thermal conductivity.

The thermally conductive filler developed by applying the technology cultivated with ceramic substrates maximally utilizes the inherent material properties of aluminum nitride (AlN) and is expected to improve the characteristics of resin products with high stability and high thermal conductivity through a consistent manufacturing process of high-quality materials and products. It is used in thermal interface materials (TIM) such as thermal grease and thermal pads, coating materials for metal substrates, and encapsulants for semiconductors, among others.

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Silicon nitride substrate

Silicon nitride products developed using ceramic materials technology.

Silicon nitride products developed using ceramic material technology are used in power semiconductor substrates and other applications due to their high strength, high toughness, and high thermal conductivity, making them suitable materials for high reliability requirements.

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Aluminum nitride substrate

Aluminum nitride products developed using ceramic materials technology.

Aluminum nitride products developed using ceramic materials technology possess excellent thermal conductivity, high electrical insulation, and characteristics such as thermal expansion similar to silicon, making them noteworthy as materials for high thermal conductivity substrates. They are used in power transistor module substrates, LED mount substrates, and IC packages.

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Glazed processed substrate

Glazed processed substrate

It is a glazed substrate with excellent surface smoothness and durability, coated with an alkali, lead-free amorphous glass on the surface of an alumina substrate. It is used in thermal print heads and other applications.

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Alumina substrate

Alumina substrate features: The alumina substrate uses carefully selected high-purity alumina raw materials, ensuring consistently stable quality and excellent characteristics.

Using carefully selected high-purity alumina raw materials, it is produced under strict quality control, ensuring consistently stable quality and excellent properties. MARUWA's alumina substrates can undergo the following processing. Please contact us for more details. - Glazing processing - Laser processing - Multilayer - Metallization processing - Punching processing - Surface polishing - Machining

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Sarantel antenna

Adoption of helical structure in our company's dielectric ceramics.

A rich product lineup including small, high-performance, multi-band, ACTIVE, and PASSIVE types. Is there a GNSS antenna like this...? MARUWA offers a wide range of GNSS antenna products utilizing ceramic technology developed over many years. We can cater to our customers' diverse needs by allowing for differentiation based on usage and design concepts. By adopting a helical structure in our proprietary dielectric ceramics, we have four key features: 1. Wide directivity 2. Strong against interference signals 3. Less affected by the human body 4. Compact

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MARUWA Alumina Substrate

Using carefully selected high-purity alumina.

Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent characteristics.

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Thin film circuit board thin film metallization

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. By combining the thin film metallization technology that MARUWA has cultivated over many years with the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. Using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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Ferrite magnet

MARUWA's ferrite magnets are ferrite-based magnets characterized by high magnetic retention.

It is widely used for speakers, communication devices, motors, suction applications, relays, medical use, various types of sensors, and more.

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Aluminum nitride parts

It has excellent thermal conductivity, high electrical insulation properties, and a thermal expansion coefficient close to that of silicon (Si), making it a focus as a high thermal conductivity material.

Aluminum nitride is used in heaters, electrostatic chucks, susceptors, clamp rings, cover plates, and other components for semiconductor manufacturing equipment, taking advantage of its high thermal conductivity and high corrosion resistance. It is also used in parts for medical devices such as MRI machines. MARUWA has established a consistent system from research and development to material production and machining, based on the material technology cultivated over many years. Through unique hot pressing methods and various machining processes, it is possible to meet the cutting-edge technological demands in semiconductor manufacturing equipment and medical applications.

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High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

Solder with excellent heat resistance for plated electrodes! Achieving high reliability, high density, and multifunctional products for various applications!

We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.

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Dielectric ceramic

It is used in the microwave band and achieves significant effects to miniaturize devices and improve the implementation density of micro-integrated circuits.

Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is possible according to size, shape, and other requirements.

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Voltage Controlled Oscillator (VCO)

MARUWA has developed various VCOs by applying the ceramic technology it has cultivated over many years.

We can customize products that meet customer needs, such as ultra-compact VCOs and small high-performance models using LTCC substrates that respond to mobile phone demands, as well as high-performance models using our own coaxial resonators.

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Band-pass filter (BPF)

MARUWA has developed a high-performance bandpass filter by applying ceramic technology that has been cultivated over many years.

We can customize products using our own dielectric coaxial resonators to meet the diverse needs of our customers.

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Ceramic valve

We have achieved high performance and high reliability through our unique material technology, long-established dry pressing technology, and high-precision processing technology.

Thanks to our excellent surface polishing technology for sliding properties, we can accommodate sliding components other than valves. By applying our in-house developed carbon coating, it is possible to further enhance the sliding properties.

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Power inductor

Power inductor with a closed magnetic circuit.

The MIB series is a power inductor that employs a closed magnetic circuit. It uses ferrite as the shield core material, achieving low radiation noise.

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Chip-type EMI filter CNF10・CNH10

This is an ultra-compact (1.6×0.8) chip-type three-terminal capacitor, ideal for countermeasures against high-frequency noise.

Due to the structurally low residual inductance, it has a better noise removal effect at higher frequencies compared to conventional capacitors. It is non-directional and easy to handle. It is compliant with the RoHS directive.

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Chip-type EMI filter CNR10

This is an SMT-compatible EMI filter with a three-terminal structure that applies chip multilayer capacitor technology.

This product reduces residual inductance (ESL) by increasing the size of the grand electrode compared to usual, significantly improving noise reduction effects in the high-frequency range. It is effective for EMI countermeasures in DC power lines, supporting large currents (~2A).

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Chip-type EMI filter CNF20

This is an ultra-compact (2.0×1.25) chip-type three-terminal capacitor, ideal for countermeasures against high-frequency noise.

Due to the structurally low residual inductance, it has a better noise reduction effect at higher frequencies compared to conventional capacitors. It is non-directional and easy to handle. It is compliant with the RoHS directive.

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Chip-type EMI filter CNH20

This is an ultra-compact (2.0×1.25) chip-type three-terminal capacitor, ideal for countermeasures against high-frequency noise.

A super small (2.0×1.25) chip-type three-terminal capacitor with structurally low residual inductance.

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Chip-type EMI filter CNF31

This is an SMT-compatible EMI filter with a three-terminal structure that applies chip multilayer capacitor technology.

Due to the structurally low residual inductance, it has a better noise reduction effect at higher frequencies compared to conventional capacitors. By offering high-capacity products, it enables noise countermeasures across a wider frequency range.

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