Package composed of high thermal conductivity AlN material.
Due to its layered structure, free wiring routing is possible. Additionally, cavity structures can be implemented to accommodate complex designs. It is a package made of high thermal conductivity AlN material that can dissipate heat when high-heat-generating chips are mounted.
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basic information
This is a substrate that uses alumina and aluminum nitride with excellent thermal conductivity, where the circuit pattern is printed and laminated, and then fired at high temperatures. The structure, which includes a surface layer where electrodes are formed, internal circuit patterns, and a bottom surface where resistors and electrodes are formed, enables the realization of a compact and multifunctional substrate. For more details, please visit our website.
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Applications/Examples of results
Sensor packages, surface mount packages, packages for MEMS, optical communication packages, LED packages, etc.
Detailed information
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Structural example (cross-section)
Company information
The name MARUWA embodies the meaning of "everyone working together in harmony." The logo of MARUWA uses blue, which is said to represent hope, and expresses the "harmony, connections, and bonds between people," which is the origin of the company name. Our company values people. We believe that a company can only achieve continuous growth and development by cherishing and utilizing the strengths and individuality of each person. It is unacceptable to suppress or distort these qualities for the sake of the company. We hope that our growth and development will contribute to the happiness of not only our employees but also the local community and many others, and we are committed to our daily business activities with all our efforts. In recent years, the importance of preserving the natural environment on this planet we live in has been emphasized from various perspectives. We feel very fortunate that the opportunities for our ceramic products to be used for environmental conservation are increasing, and the demands and expectations for these products and new innovations are becoming stronger.
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