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フォトプレシジョン

addressTokyo/Hachioji-shi/2-7-5 Chiyomachi
phone042-666-8211
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last updated:Nov 12, 2020
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フォトプレシジョン List of Products and Services

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Frosted glass (frosted glass)

It is used for decorations of antique-style glass products and stained glass!

"Glue chip glass (frosted glass)" is glass adorned with patterns resembling feathers on its surface. It is used for the decoration of antique-style glass products and stained glass. Due to the frost-like shape of its patterns, it is sometimes referred to as "kessō glass," and because the production process involves the use of glue, it is also called "nikawa glass." The patterns created from the stress of the glue drying result in beautiful lace patterns, each unique. 【Features】 ■ Glass adorned with feather-like patterns on the surface ■ Used for the decoration of antique-style glass products and stained glass ■ Each piece features beautiful lace patterns that are one of a kind *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to 3D Photolithography Processing Technology

Processing technology using "electroplating"!

"3D Photo Riso" is a processing technology that can uniformly form a resist film on any conductive surface. It was developed using "electroplating," which involves immersing the entire substrate in a liquid phase to deposit a metal film. This technology enables photolithography processing to be applied to the entire three-dimensional shape, including edges and corners. 【Features】 ■ Uniform formation of resist film on conductive surfaces ■ Utilizes "electroplating" ■ Photolithography processing possible on the entire three-dimensional shape, including edges and corners *For more details, please refer to the catalog or feel free to contact us.

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Introduction to High Aspect Ratio Resist Processing Technology

Aspect ratio 1:5 processing results! Can be used in a wide range of fields!

Our company is capable of processing using "high aspect ratio resist" with a high aspect ratio between pattern line width and film thickness (height). We have a proven track record of processing with an aspect ratio of 1:5. With this technology, the resist pattern becomes not just a protective film but a fine three-dimensional structure, expanding its range of applications. 【Features】 ■ Proven track record of processing with an aspect ratio of 1:5 ■ Wide range of applications *For more details, please refer to the catalog or feel free to contact us.

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Introduction to Electrolytic Plating Processing Technology

Introduction of a plating system compatible with 6-inch wafers! Processing technology capable of forming films of a few micrometers.

"Electroplating" is a processing technology that involves immersing a substrate in an aqueous solution containing ionized metal and passing electricity through the solution to deposit metal onto the surface of the substrate. Film formation through vapor deposition is typically less than 1μm, while plating can form films of several micrometers. Additionally, there is a technology called "semi-additive method" that utilizes this technique to create fine plating patterns. [Features] ■ Deposits metal on the surface of the substrate by passing electricity through the solution ■ Can be used in precision machining fields to achieve desired metal film thickness ■ Capable of forming films of several micrometers ■ Applicable to create fine plating patterns using the "semi-additive method" ■ Introduced a plating system compatible with 6-inch wafers *For more details, please refer to the catalog or feel free to contact us.

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Introduction to Silicon Etching Processing Technology

By selecting the type of crystal orientation, you can choose the type of groove processing!

"Silicon etching" is a processing technology that corrodes the silicon substrate itself to form three-dimensional structures. There are two types of silicon corrosion: one that progresses in a specific direction (anisotropic) and one that progresses in all directions (isotropic). When performing anisotropic etching, single-crystal silicon is used for the substrate, and an etching solution such as KOH aqueous solution is employed. Single-crystal silicon wafers are categorized by crystal direction, and by selecting this, the type of groove processing can be chosen. Additionally, isotropic etching can also be performed depending on the type of etching solution used. [Features] - Corrodes the silicon substrate itself to form three-dimensional structures - Allows selection of groove processing types by choosing the type of crystal direction - Isotropic etching is also possible depending on the type of etching solution *For more details, please refer to the catalog or feel free to contact us.

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Introduction to Glass Etching Processing Technology

Corrode the surface of the glass with chemicals such as hydrofluoric acid!

"Glass etching" is a processing technique that involves corroding the surface of glass with chemicals such as hydrofluoric acid to create grooves and relief patterns. As substrate materials, quartz and borosilicate glass such as BK7 are used. Additionally, a metal thin film patterned by photolithography is used as a mask, allowing for the formation of high-precision patterns. 【Features】 - Uses quartz and borosilicate glass such as BK7 as substrate materials - Utilizes a metal thin film patterned by photolithography as a mask - Capable of forming high-precision patterns - Dimension control in the depth direction is possible - The surface finishes relatively smoothly *For more details, please refer to the catalog or feel free to contact us.

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Introduction to Thin Film Coating Processing Technology

Thin film coating that can coat most metals, metal oxides, and dielectric films!

Our company offers film deposition processing using PVD techniques, including resistance heating vacuum deposition, EB heating vacuum deposition, and sputtering methods. By utilizing these processing technologies, we can coat almost all metals, metal oxides, and dielectric films. Please feel free to consult us if you have any requests. 【Features】 ■ Film deposition processing is possible using resistance heating vacuum deposition, EB heating vacuum deposition, and sputtering methods. ■ Coating of almost all metals, metal oxides, and dielectric films is possible. *For more details, please refer to the catalog or feel free to contact us.

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High aspect ratio resist

High aspect ratio resist

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. We have achieved the ability to give height to flat resist patterns! ■□■ Features ■□■ ■ The resist pattern is used as a protective film to shield metal thin films and other materials from etching solutions during the etching process. ■ To realize high-precision metal patterns, high-resolution photoresists with excellent adhesion and melting properties are being researched and developed. For more details, please download the catalog or contact us.

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Thin film coating compatible with metals, metal oxides, and dielectric films.

Thin film coating compatible with metals, metal oxides, and dielectric films.

Introducing Photoprecision, a company that contributes to prototyping and development in various fields, including microelectronics and optics, with photofabrication as its core technology. We can coat most metals and metal oxides! ■□■ Features ■□■ ■ We have in-house resistance heating vacuum deposition, EB heating vacuum deposition, and sputtering equipment. ■ Resistance heating vacuum deposition A deposition method that heats and evaporates thin film materials (targets) in a vacuum and deposits them onto the substrate surface. ■ E.B. heating vacuum deposition A deposition method that heats and evaporates the target in a vacuum and deposits it onto the substrate surface. ■ Sputtering A film formation method where argon positive ions impact the target, and the atoms ejected by the impact arrive at the substrate surface to form a film. ■ Please feel free to inquire about other types of films, film thicknesses, and multilayer films. We can accommodate a wide range of substrate types and sizes.

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Sandblasting process

Sandblasting process

This is an introduction to Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. The technique of "sandblasting" involves striking sand against relatively hard substrates such as glass, silicon, and quartz using air pressure to carve out grooves and holes on the substrate surface. ■□■ Features ■□■ ■ Patterns can be created on the substrate surface using dry film resist for sandblasting, allowing for the desired groove processing by masking. ■ The processed surface becomes sandy. ■ Depth control is possible by adjusting the processing time. ■ For more details, please download the catalog or contact us.

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Silicon etching

Silicon etching

Introducing Photoprecision, a company that contributes to prototyping and development in various fields, including microelectronics and optics, with photofabrication as its core technology. "Silicon Etching" Overview A technology that corrodes the silicon substrate itself to form three-dimensional structures. ■□■ Features ■□■ ■ Utilizes the crystal orientation of silicon to achieve flat-walled grooves (anisotropic etching). Can form V-shaped and rectangular grooves. ■ Depending on the type of etching solution, rounded edges can be created on the groove walls, allowing for isotropic etching as well. ■□■ Types of Processing ■□■ ■ V-Groove Processing - Using silicon material with a <100> surface orientation, V-shaped grooves are formed. - The angle of the slope remains constant (54.7°). ■ Rectangular Groove Processing - Using silicon material with a <110> surface orientation, rectangular grooves are formed. - Due to the crystal structure, the orientation of the grooves tilts at 54.7° to the side. ■ Isotropic - Etching progresses uniformly in all directions. ■ For more details, please download the catalog or contact us.

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Electroplating

Electroplating

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. This is an introduction to "Electroplating." Processing that involves placing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. ■□■Features■□■ ■ Introduction of a plating system compatible with 6-inch wafers ■ While film formation by vapor deposition is usually less than 1μm, plating can form films of several μm ■ Suitable for processing three-dimensional shapes ■ As a metal film, it can be used for circuit formation requiring specific film thickness or as a sacrificial film for lift-off, and it is also possible to form fine bumps by raising part of the pattern ■ For other functions and details, please download the catalog or contact us.

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Glass etching processing

Glass etching processing

This is an introduction to Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. The technology involves etching the surface of glass with chemicals such as hydrofluoric acid to create grooves and engravings. ■□■ Features ■□■ ■ Quartz and borosilicate glass such as BK7 are used as substrate materials. ■ Metal thin films patterned by photolithography are used as masks, allowing for high-precision pattern formation. ■ Dimensional control in the depth direction is also possible. ■ Since the etching is done with chemicals, the surface finishes relatively smoothly. ■ For more details, please download the catalog or contact us.

  • Glass Decoration Materials

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Electrostatic resist.

Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.

3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies, MENS devices require techniques to process complex and delicate patterns in three-dimensional structures. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.

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