[Example] "Particle-PLUS" RF Magnetron Sputtering
Introduction to Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis" Simulation Case
This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is difficult. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.
- Company:ウェーブフロント 本社
- Price:Other